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Custom Tungsten Needles

In the wave of modern technological advancements, the demand for precision machining is steadily rising. From microelectronic components to medical devices, there’s an ever-growing need for highly precise tools and parts. Leading the charge in this arena is WET High Precision Metal Machining Company, specializing in crafting super-precise tungsten needles with a minimum tip radius of just 0.001 inches.

For medical

Hook-type 99.5% tungsten needle

These miniature precision microtool tips are helpful for particle manipulation or sample prep. They are available as individual interchangeable tips.

Tungsten alloy with durable 0.001″ radius tip

90° Microhook 99.5% tungsten

These miniature precision microtool tips are helpful for particle manipulation or sample prep. They are available as individual interchangeable tips.

99.5% tungsten Microneedle – Straight

These miniature precision microtool tips are helpful for particle manipulation or sample prep. They are available as individual interchangeable tips. 

Industrial use (laboratory, etc.)

In addition, we can also perform custom threading on tungsten needles.

Thread SizeThread Diameter (mm)Pitch (mm)
M33 mm0.5 mm
M3.53.5 mm0.6 mm
M44 mm0.7 mm
M55 mm0.8 mm
M66 mm1 mm
M88 mm1.25 mm
M1010 mm1.5 mm
M1212 mm1.75 mm
M1414 mm2 mm
M1616 mm2 mm
M1818 mm2.5 mm
M2020 mm2.5 mm
M2222 mm2.5 mm
M2424 mm3 mm
M2727 mm3 mm
M3030 mm3.5 mm
Threaded tungsten needle customization

Crafting tungsten needles is a complex and highly precise art. It requires specialized expertise and cutting-edge equipment to ensure every needle meets the highest standards. At WET, we boast extensive experience and leading-edge technology to meet even the most stringent demands of our clients.

If you have Custom tungsten needles, please feel free to contact us.

    FAQs

    [FAQS]

    Our strength lies in our ability to offer customized solutions. Whether it’s the size of the tip radius or the length and shape of the needle, we can tailor our products to fit our clients’ exact specifications. This personalized service allows us to cater to the diverse needs of various industries, providing our clients with optimal solutions.

    In addition to customization, we prioritize quality control. Throughout the production process, we maintain strict control over every step to ensure each needle meets the highest quality standards. Employing advanced inspection equipment and techniques, we conduct precise testing on each needle to ensure its accuracy and stability.

    Furthermore, we value communication and collaboration with our clients. We remain open-minded, listening to our clients’ needs and feedback, continuously improving and optimizing our products and services. We understand that customer satisfaction is our greatest motivation, so we are committed to providing exceptional products and services.

    Custom tungsten needles are one of WET High Precision Metal Machining Company’s core competencies. With our wealth of experience, leading-edge technology, and top-notch service, we can meet our clients’ various needs for super-precise tungsten needles. Whether in electronics, medical, aerospace, or other fields, we can provide our clients with the best solutions to help them achieve greater success. If you have any inquiries or questions about our products or services, please don’t hesitate to contact us. We are here to serve you wholeheartedly.

    Blog

    Understanding Semiconductor Etching

    Semiconductor etching is a crucial step in the fabrication of electronic devices, allowing for the precise removal of material layers from semiconductors. This process is instrumental in creating the intricate patterns necessary for the functioning of integrated circuits.

    If you want to produce PCBs, or semiconductors independently. Then I will disabuse you of the idea, because trying to produce PCBs or semiconductors complete and independently, I don’t think any company can afford the investment cost.

    Let’s start simply by understanding the PCB fabrication process.

    If you want to produce your own pcb's, then you need this equipment - PCB equipment list
    If you want to produce your own pcb’s, then you need this equipment – PCB equipment list

    1. Semiconductor Etching Equipment:

    1.1 LDI High-Precision Exposure Machine: The LDI (Laser Direct Imaging) high-precision exposure machine plays a vital role in the semiconductor etching process. This equipment uses laser technology to selectively expose photoresist-coated semiconductor wafers, defining the patterns that will guide the subsequent etching steps. LDI machines offer exceptional precision, enabling the production of intricate and miniaturized semiconductor components.

    1.2 Chemical Etching Equipment: Chemical etching equipment is designed to selectively remove material layers from semiconductor wafers. Among the common types are wet chemical etching and dry etching systems.

    • Wet Chemical Etching:
      • Equipment Overview: Wet chemical etching involves immersing the semiconductor wafer in a chemical solution to selectively remove material.
      • Role: The equipment facilitates controlled material removal, allowing for the creation of precise patterns.
      • Common Equipment: Manufacturers such as Dragon Etching provide wet chemical etching systems, ensuring uniform and controlled etching processes.
    • Dry Etching Systems:
      • Equipment Overview: Dry etching, including techniques like reactive ion etching (RIE) and plasma etching, employs gases and plasmas to remove material.
      • Role: These systems offer high-precision etching with minimal damage to the underlying material.
      • Common Equipment: Oxford Instruments is a reputable manufacturer of dry etching systems, providing solutions for various semiconductor materials.

    2. Common Etchants in Semiconductor Etching:

    Analyzing several common etchants is crucial to understanding their application and parameters. Below is a table summarizing some commonly used etchants:

    EtchantCompositionSelectivityTemperature (°C)Etch Rate (nm/min)
    Buffered HFHF + NH4FHighAmbient~1 – 10
    Piranha SolutionH2SO4 + H2O2ModerateAmbientVariable
    KOHKOHHigh~50 – 80~50 – 100
    SF6 PlasmaSF6 + O2High~50 – 100~10 – 100
    Semiconductor etchant

    3. Basic Applications of Semiconductor Etching:

    The semiconductor etching process finds applications in various industries, including:

    • Glass Etching: Used for creating microstructures on glass surfaces.
    Glass Etching
    • Silicon Wafer Etching: Critical in the production of integrated circuits.
    Semiconductor etch
    • MEMS (Micro-Electro-Mechanical Systems): Enables the fabrication of miniature mechanical components on semiconductor wafers.
    MEMS (Micro-Electro-Mechanical Systems)

    Semiconductor Etching Process Flow:

    3.1. Photoresist Application:

    • A thin layer of photoresist is applied to the semiconductor wafer.

    3.2. Exposure:

    • The LDI high-precision exposure machine selectively exposes the photoresist to define the desired patterns.

    3.3. Development:

    • The exposed photoresist is developed, revealing the pattern on the semiconductor surface.

    3.4. Etching:

    • The semiconductor wafer undergoes wet or dry etching, selectively removing material based on the developed pattern.

    3.5. Resist Stripping:

    • Any remaining photoresist is removed, leaving behind the etched semiconductor pattern.

    Semiconductor etching is a sophisticated process with a range of specialized equipment and etchants, crucial for the production of advanced electronic devices. Understanding the intricacies of this process is essential for achieving precision and efficiency in semiconductor fabrication.

    If you have PCB or semiconductor processing in mind, please do not hesitate to contact us. Contact us today. We will provide you with processing and manufacturing services. All you need to do is provide us with the appropriate drawings.

      Blog

      Unveiling the Versatile Applications of Wet Etching in Diverse Fields

      Wet etching is a dynamic and versatile process, playing a pivotal role in a wide range of application areas. From microelectromechanical systems (MEMS) to semiconductor manufacturing, solar cell production, microfluidics, and photolithography, wet etching offers its unique solutions. In this article, we’ll explore the fascinating world of wet etching in different fields, delving into its diverse applications, specific needs, and the challenges it addresses. By the end of this read, you’ll have a comprehensive understanding of the profound impact of wet etching across multiple domains.

      Microelectromechanical Systems (MEMS) Wet Etching

      MEMS wet etching is an essential process in MEMS fabrication, where tiny mechanical and electronic devices are created. These devices, often used in sensors, actuators, and more, rely on wet etching to define their structures.

      Semiconductor Wet Etching

      In the world of semiconductor manufacturing, wet etching is a cornerstone process. It is used to define circuit patterns, remove unwanted layers, and shape intricate features on semiconductor wafers.

      Solar Cell Wet Etching

      Solar cell production relies on wet etching to texture the surface of solar panels, enhancing light absorption and overall energy efficiency. This is a key step in creating effective photovoltaic cells.

      Microfluidic Wet Etching

      Microfluidics is a cutting-edge field with applications in healthcare, chemistry, and biology. Wet etching is used to create intricate microchannels and structures for precise fluid control.

      Photolithography Wet Etching

      Photolithography is a fundamental technique in microfabrication. Wet etching is employed to define patterns in a photoresist, transferring these patterns onto the underlying material.

      • For a detailed explanation of photolithography wet etching, refer to this SPIE article.

      Addressing Unique Needs and Challenges

      Wet etching is an art that requires a deep understanding of materials, etchants, and process control. Each application area presents its own set of challenges. The choice of etchant, temperature control, and etching time are just a few of the variables that must be considered.

      • In semiconductor manufacturing, precision and selectivity are paramount.
      • In solar cell production, the focus is on enhancing light capture.
      • Microfluidics demands intricate microchannel fabrication.
      • Photolithography requires precise pattern transfer.

      These varying needs and challenges underscore the importance of expertise and innovation in wet etching processes tailored to each application.

      Wet etching is more than just a materials processing technique; it’s a transformative force across multiple fields. From MEMS and semiconductor manufacturing to solar cell production, microfluidics, and photolithography, wet etching continues to reshape technology and science. By understanding its applications, unique requirements, and challenges, we can fully appreciate the profound impact it has on our world.

      As technology and science advance, wet etching will undoubtedly find new applications and continue to push the boundaries of what is possible in each of these exciting fields.

      Blog

      Exploring the Impact of Wet Corrosion on a Variety of Materials

      Wet etching is a fundamental process in materials science and engineering. Its impact on various materials, from silicon to copper, glass, gold, silicon nitride, sapphire, tungsten, and metals, is both profound and diverse. In this article, we will delve into the world of wet etching and its effects on these materials. We’ll discuss the importance of selecting the correct etching method and share insights on how to navigate wet etching challenges for different materials. By the end of this article, you’ll have a comprehensive understanding of the complex relationship between wet etching and different materials.

      Understanding Wet Etching

      Wet etching is a chemical process that selectively removes material from a substrate by immersing it in a chemical solution. Its effects on various materials are intriguing and often require careful consideration.

      Learn about the metals we can etch and the etching methods.

      Effects on Silicon

      Silicon is a commonly used semiconductor material. Wet etching can precisely shape silicon, making it a critical process in microfabrication. The wet etching of silicon is an area of extensive research and development.

      Implications for Copper

      Wet etching can be a powerful tool in the electronics industry. For instance, it plays a role in the fabrication of printed circuit boards (PCBs), where copper layers must be etched to create intricate circuit patterns. Learn more about copper etching.

      Wet Etching of Glass

      Glass is another fascinating material when it comes to wet etching. Understanding the wet etching of glass is crucial for applications like microfluidics and optical components.

      Gold and Its Properties

      Gold, known for its chemical stability, can be etched using various wet etching techniques. This process is significant in creating gold-based microelectrodes for biological and electronic applications. Explore gold etching methods.

      Wet Etching of Silicon Nitride

      Silicon nitride is a material often used in microelectronics and MEMS. Wet etching of silicon nitride is complex and requires precise control. Learn about silicon nitride wet etching.

      Effects on Sapphire

      Sapphire, prized for its hardness and optical properties, is used in various applications. Wet etching plays a role in shaping sapphire for optical components. Discover the intricacies of sapphire etching.

      Tackling Wet Etching of Tungsten

      Tungsten, a material with high melting and boiling points, is a vital component in electronics. Understanding wet etching of tungsten is essential for device fabrication.

      Etching Various Metals

      The wet etching of metals is a diverse field, as each metal behaves differently in various etchants. Explore the etching of different metals to appreciate the nuances.

      Choosing the Right Etching Method

      Selecting the correct wet etching method is crucial to achieving the desired results. Parameters such as the choice of etchant, etch rate, and etch selectivity must be considered.

      Factors to Consider

      • Etching solutions
      • Temperature control
      • Etching time
      • Masking techniques
      • Safety precautions

      Wet etching is a versatile and valuable process in materials engineering. Its effects on different materials, from silicon to metals, are profound and often lead to innovative solutions in technology and manufacturing. By understanding the intricacies of wet etching and choosing the right method for the material at hand, engineers and researchers can unlock the full potential of this essential technique.

      Watch this video for a visual overview of Wet Etching Techniques.

      As the world of materials science and technology continues to advance, the relationship between wet etching and materials will undoubtedly yield more discoveries and applications, shaping the future of innovation.

      Blog

      Understanding Wet Etching and Dry Etching in Semiconductor Fabrication

      The semiconductor industry is a complex web of processes, each playing a vital role in shaping the technology we use every day. Among these processes, etching stands out as a crucial step in defining and patterning various semiconductor components. In this article, we will unravel the intricacies of two primary etching methods – wet etching and dry etching – exploring how they work, their advantages, disadvantages, and specific applications. By the end of this read, you’ll possess a comprehensive understanding of these techniques and their pivotal role in semiconductor manufacturing.

      Wet Etching: A Chemical Approach

      Wet etching, also known as chemical etching, is a chemical process used extensively in semiconductor manufacturing. This method involves immersing a semiconductor wafer into a chemical solution to selectively remove specific layers or materials. Let’s dissect the fundamental aspects of wet etching:

      How Wet Etching Works:

      Wet etching relies on chemical reactions to remove unwanted materials from the semiconductor surface. A common technique within this category is chemical wet etching, where the composition of the chemical solution is carefully tailored to dissolve the target material while leaving the rest of the wafer untouched. For a more in-depth understanding, refer to this article on Chemical Etching.

      Anisotropic vs. Isotropic Wet Etching:

      Within wet etching, there are two fundamental categories – anisotropic and isotropic wet etching. Anisotropic etching removes material preferentially in one direction, resulting in sharply defined features, while isotropic etching removes material uniformly in all directions, yielding rounded features. For a visual representation, watch this informative video on Anisotropic and Isotropic Etching.

      Advantages and Disadvantages of Wet Etching:

      Wet etching offers precise control over etch depth and selectivity, making it suitable for intricate semiconductor structures. However, it has its drawbacks, such as limited control over lateral etching and the need for specialized chemical solutions.

      Dry Etching: The Physical Approach

      Dry etching, in contrast to wet etching, is a physical process that employs plasma or reactive gases to remove material from the wafer surface. Here’s a deeper dive into dry etching:

      How Dry Etching Works:

      Dry etching utilizes various techniques, such as reactive-ion etching (RIE) and inductively coupled plasma (ICP) etching, where a combination of gases and high-energy ions selectively etches the semiconductor material. For a detailed exploration of these techniques, refer to this scholarly article on RIE and ICP Etching.

      Advantages and Disadvantages of Dry Etching:

      Dry etching allows for precise control over etch profiles and high aspect ratios, minimizing lateral etching. However, it can be more expensive due to the equipment required and can pose challenges related to uniformity.

      Applications of Wet Etching and Dry Etching

      Semiconductor manufacturers often choose between wet etching and dry etching based on the specific requirements of their processes. Here are some key applications for each:

      • Wet Etching: Commonly used in MEMS (Micro-Electro-Mechanical Systems) fabrication, wet etching is ideal for applications where precise control over feature shapes is crucial.
      • Dry Etching: It finds its place in fabricating integrated circuits, microprocessors, and memory devices, where high aspect ratios and fine features are necessary.

      Understanding the principles of wet etching and dry etching is essential in the semiconductor industry, as it influences the success and precision of fabrication processes. Each method has its unique strengths and weaknesses, and the choice between them depends on the specific needs of the semiconductor device being manufactured.

      As semiconductor technology continues to advance, these etching techniques will evolve, offering even greater precision and control. To gain a glimpse into the future of semiconductor etching, watch this informative video on The Future of Semiconductor Etching.

      By exploring wet etching and dry etching in detail, you’re now better equipped to navigate the intricacies of semiconductor fabrication. Whether you’re a professional in the field or simply intrigued by the world of microelectronics, this knowledge empowers you to appreciate the marvels of modern technology.

      Blog

      Guide to Drawing Standard Etching Design

      Wet etching is a fundamental process in microfabrication, allowing precise material removal to create intricate patterns and structures on substrates. The success of wet etching hinges on a series of design criteria that engineers and scientists must meticulously consider. In this blog, we will explore the key design criteria for wet etching, focusing on assumptions, dimensions, and the importance of hole size in achieving the desired results.

      Design Criteria for Wet Etching

      1. Assumptions Matter: Before delving into the design criteria, it’s crucial to set the right assumptions. For instance, in the case of wet etching, we assume a specific thickness. For the purpose of this discussion, let’s consider a thickness ranging from 0.1mm.
      2. Etching design formulas versus material thickness: Assuming a material thickness of 0.1mm, one of the first design criteria to consider is the hole diameter. To ensure proper etching, it’s often recommended to make the hole slightly larger than the material thickness. In this case, 1.2 times the material thickness would be 0.1mm * 1.2 = 0.12mm. Therefore, if the material thickness is 0.1mm, the hole should be designed to have a diameter of at least 0.12mm.
      3. Material Choice: The choice of material plays a significant role in wet etching. Different materials react differently to etchants. Engineers must select materials that are compatible with the chosen etchant to ensure a successful process.
      4. Hole Size Matters: The size of the holes created during wet etching is a critical design criterion. Smaller holes may lead to incomplete material removal, while larger holes may compromise structural integrity. Typically, materials with a thickness of 100μm or less can accommodate holes with a diameter of 0.12mm or more. Larger holes often result in more aesthetically pleasing and structurally sound outcomes.
      5. Alignment and Precision: Achieving precise alignment of the etched features is vital. Design drawings should incorporate alignment markers or registration features to ensure accurate positioning during the etching process. This is particularly crucial when dealing with multilayer structures or when specific patterns must be aligned with pre-existing features.
      6. Minimum Feature Size: It’s advisable to establish a minimum feature size for your design drawings. For instance, it’s generally recommended that no marked details be smaller than 0.1mm. This corresponds to 100μm. Maintaining a minimum feature size helps ensure that the etching process can accurately replicate the desired patterns and structures without the risk of incomplete or distorted etching.
      7. Quality Control and Inspection: Design criteria should include provisions for quality control and inspection during and after the wet etching process. This involves specifying methods and tools for verifying that the final product meets the intended design specifications. Inspection processes may include optical microscopy, surface profilometry, or other measurement techniques to validate critical dimensions and surface finish.

      Conclusion

      Wet etching is a precise and versatile process used in microfabrication and nanotechnology. Proper design criteria are essential for achieving the desired results. By considering factors such as material thickness, hole size, material choice, alignment, surface finish, and etchant properties, engineers can ensure successful wet etching processes that meet the demands of various applications. The art of wet etching lies in the meticulous attention to these design criteria, resulting in finely etched structures that drive innovation across multiple industries.

      If you have more discussions about etching standards, please contact me to add them and cite the source!

      Blog

      How to choose a photochemical etching company?

      How do I select a photochemical etching service company if I need to use photochemical etching brass for a project right now?

      Experience and Expertise:

      Ensure that the company you choose has ample experience and expertise, particularly in dealing with brass.

      They should understand the characteristics of brass to effectively perform photochemical etching.

      Equipment and Technology:

      Familiarize yourself with the equipment and technology the company uses. Modern equipment often provides higher precision and efficiency. Ensure that their equipment and technology align with the requirements of your project.

      Quality Control:

      Inquire about the company’s quality control processes. They should have rigorous quality control standards to ensure your project meets the expected quality standards.

      Project Scale:

      Consider the scale of your project. Some companies may be better suited for large production batches, while others specialize in small batches or custom projects. Choose a company that fits the scale of your project.

      Delivery Time:

      Understand the company’s delivery times. If you have time constraints, ensure that the company can complete the project on schedule.

      Cost and Budget:

      Lastly, consider costs and your budget. Discuss project costs with the company and ensure they align with your budget.

      Photochemical Etching Service Specialists

      No1:Dragon Etching

      Dragon Etching are a dedicated team of experts specializing in Photochemical Etching services and manufacturing.

      Why Choose Dragon Etching?

      Dragon Etching stands out from other Photochemical Etching service providers in several key ways:

      • In-House Machine Manufacturing: We are not just a service provider; we also manufacture Photochemical Etching machines. Click here to learn about the Photochemical Etching Equipment Selection Guide. This unique capability allows us to offer customized solutions, tailored to your specific needs. Whether you need our services or a customized DIV Photochemical Etching Machine, we have you covered.
      • Advanced Laboratory Facilities: Our state-of-the-art laboratories are equipped with the latest machinery and technology, ensuring consistent and high-quality results for our clients.
      • Rapid Turnaround: We understand the importance of timely project completion. Our streamlined processes enable us to offer some of the fastest turnaround times in the industry, ensuring your projects are completed efficiently and on schedule.

      No2:Wet Etching

      In the realm of Photochemical Etching, Wet Etching is a prominent and indispensable process. It’s a method that involves selectively removing material from a substrate using chemical solutions. This process is widely employed in various industries for its ability to precisely define intricate patterns on different materials, making it essential for applications such as microelectronics, semiconductor fabrication, and precision engineering.

      Meet WET ETCHING – The Pioneers of Wet Etching

      In the world of Wet Etching, one company stands out as a true industry leader – WET ETCHING. With a rich history of innovation and a commitment to excellence, WET ETCHING has redefined the standards of wet etching in the world of photochemical processes.

      Leadership in Wet Etching

      Cutting-Edge Technology: WET ETCHING has consistently pushed the boundaries of wet etching technology. They employ cutting-edge machinery and state-of-the-art chemical solutions to achieve precision and efficiency that surpass industry norms. Their dedication to research and development keeps them at the forefront of technological advancements in the field.

      Experienced Team: At WET ETCHING, it’s not just about the technology; it’s also about the people. Their team of seasoned experts boasts extensive experience in wet etching, allowing them to tackle complex projects with finesse. Their skillful hands and keen eyes ensure that each etching process is executed flawlessly.

      Custom Solutions: Recognizing that each project has its unique requirements, WET ETCHING specializes in providing tailored solutions. Whether it’s semiconductor components, microelectromechanical systems (MEMS), or intricate precision parts, WET ETCHING can design a wet etching process that perfectly aligns with the specific demands of the project.

      Stringent Quality Control: The hallmark of WET ETCHING’s leadership is their unwavering commitment to quality control. Every product that leaves their facility undergoes rigorous testing and inspection to guarantee precision and reliability. Clients can trust that their projects are in safe hands when partnering with WET ETCHING.

      Collaborative Approach: WET ETCHING’s success isn’t just a testament to their technology and expertise; it’s also a result of their collaborative approach. They actively engage with their clients, fostering a partnership that ensures project success. By understanding their clients’ needs, challenges, and goals, they deliver wet etching solutions that exceed expectations.

      In the world of wet etching, WET ETCHING is more than just a company; it’s a beacon of innovation and precision. Their leadership in photochemical etching is a testament to their unwavering dedication to pushing the boundaries of what’s possible. With cutting-edge technology, a skilled team, and a commitment to quality, WET ETCHING continues to shape the future of wet etching, one precise etch at a time.

      No3：Precision Micro

      Pioneers in photochemical etching. Market-leading photochemical machining company supplying precision-etched metal components to exacting specifications

      The leading photochemical etching service for 60 years.

      From stainless steels to nickel, copper, aluminium and more, we’ve been innovating photochemical machining technology for more than half a century.

      We produce and supply millions of precision photo-etched components every year for industry-leading companies all over the world, stretching the boundaries of micro-precision component manufacture.

      No4:Masteretch

      Masteretch design and manufacture chemical etching equipment. From small-scale laboratory machines to large mass production etching lines, Masteretch serve a wide range of industries.

      Beyond our core range of equipment we can also deliver tailored etching solutions designed to meet your unique requirements. Our expertise in fabrication and design allows us to offer a high degree of customization to help our customers achieve their objectives.

      Masteretch systems are expertly designed, assembled in-house at our UK facility and fully tested prior to shipping. Our equipment is designed to operate at maximum efficiency and for long term use at high volume production levels. Masteretch systems are renowned for their dependability, low operating and maintenance costs, making Masteretch the equipment supplier of choice for many of the world’s leading etching companies.

      No5:ADVANCED METAL ETCHING, INC.

      We understand that the success of your project depends on delivering quality parts manufactured at the right cost and within your timeline. We know the challenges of choosing the proper manufacturing process for your parts, and we’re here to help you navigate the process quickly and confidently.

      Our custom metal parts manufacturing facility specializes in the photo etching and laser cutting processes. Both provide the highest quality and precision for today’s part designs. With a keen eye for spotting potential issues, we ensure that your part is the first step toward a successful product launch, and we strive to eliminate unnecessary delays.

      Our team is dedicated to providing exceptional service and responsive attention to keep you in control of your project and out of the dark.

      No6:Interplex

      As a world leader in designing and manufacturing interconnect and mechanical products, we solve complex customer challenges and bring ideas to life.

      We create value by helping our customers reduce their Total Cost of Ownership through utilizing our technical expertise, vertically integrated manufacturing, global footprint and innovative technologies enabling us to deliver interconnect products shaping the fields of Mobility, Medical, and Information & Communications.

      No7:Elcon

      Whether in fully custom prototyping or high-volume production, we employ team-wide expertise in each of our core disciplines to provide precision parts that are built to succeed.

      In addition to collaborating on outside-the-box applications, we also specialize in the manufacture of key precision products, all designed and built for critical applications.

      No8:TMN

      Founded in 2011, TMN Etch specializes in photo chemical etching (PCE), serving worldwide companies with custom precision metal parts to meet their needs. The photo chemical etching process can be applied in a wide range of raw materials, such as stainless steel 300 series, brass alloy, copper alloy, aluminum, chrome, and other special metal alloys. With the photo chemical etching process, TMN Etch provides prototypes according to your drawings within 3 days without any tooling cost, and you can modify your designs whenever you want. Free samples, shorter lead time, tighter tolerance, higher precision, and lower cost for high volume production are the promises of TMN Etch to you.

      Blog, Metal Etching, Photo Etching

      Wet Chemical Etching Germanium

      Germanium is a unique semiconductor material with excellent optical and electrical properties. Its high refractive index, low absorption coefficient, and good thermal conductivity make it valuable in various applications, including infrared optics and electronics.

      [custom_pricing]

      Our Germanium etching production facility

      Wet Metal Etching Production workshop- Shenzhen Xinxin Precision Equipment Co., Ltd.
      Our Germanium etching production facility

      Germanium Characteristics:

      Germanium possesses several key properties that contribute to its diverse applications:

      1. Optical Transparency: Germanium is transparent in the infrared region, making it valuable for infrared optics and lenses.
      2. High Refractive Index: Germanium’s high refractive index allows for efficient light bending, suitable for lenses and prisms.
      3. Electrical Properties: Germanium is a semiconductor material with good electrical conductivity, making it useful in electronic devices.
      4. Thermal Conductivity: Germanium has reasonable thermal conductivity, aiding in heat dissipation.

      Metal Etching Germanium:

      Metal etching is a precise process used to selectively remove material from the surface of germanium to create intricate patterns and designs. When etching germanium, the choice of etchant is critical for achieving optimal results:

      1. Hydrogen Peroxide (H2O2) and Hydrochloric Acid (HCl) Solution: Advantages: This mixture is effective for etching germanium due to its ability to dissolve germanium oxide.
      2. Bromine (Br2) and Methanol (CH3OH) Solution: Advantages: Bromine and methanol solution can be used for controlled etching of germanium, providing precise pattern transfer.

      Germanium etching equipment

      Wet Chemical S650 Germanium Etching Machine

      Selling Price:
      $12,000.00

      S650 WET Etching MachineDownload

      Wet Processing Equipment – Germanium etching machine

      The Germanium etching machine is used to spray chemical solution to a copper-clad laminator, aluminum substrate, or stainless steel plate, the exposed copper, aluminum, and stainless steel are etched away, retaining the pattern or circuit covered by the corrosion-proof film, so as to achieve the purpose of making pattern or circuit.

      This etching machine is an all-in-one small Germanium etching machine that is easy to install and can be used immediately after powering on.

      Photo Etching Germanium:

      Photo etching is a precise process used for intricate designs on germanium:

      1. Material Film: Photomasks made of high-quality polymer films with excellent UV resistance are recommended for precise and detailed etching.
      2. Temperature Control: Maintain a stable and controlled temperature during the photoresist exposure and development process to ensure accurate pattern transfer.

      Germanium’s exceptional optical and electrical properties make it a valuable material for infrared optics and electronic devices. By understanding the etchants, surface treatment methods, electroforming techniques, metal cleaning, and photo etching processes for germanium, manufacturers can achieve exceptional results without compromising the material’s integrity. Applying these insights will enable the production of high-quality germanium components for diverse applications, ranging from infrared imaging to electronic devices and beyond.

      View our metal etching products

      how to etch Germanium?

      Etching Germanium Process Guidelines

      MetalEtchantTemperature (°C)Concentration (%)Estimated Etch Depth (microns)Etch Quality
      GermaniumH2O2 and HCl (Aqua Regia)Room temperature3% H2O2, 30% HCl1-5High-quality (smooth)
      GermaniumBromine (Br2) and Methanol (CH3OH)Room temperature10% Br2, Methanol5-20Moderate-quality (etched)

      The values provided are approximate and can vary depending on specific etching conditions, including exposure time, agitation, and the condition of the Germanium surface. Always conduct test etches and adjust parameters as needed to achieve your desired results. Additionally, safety precautions should be followed when handling these chemicals, especially in the case of Aqua Regia.

      If you have metal wet etching Germanium needs, please feel free to contact us.

        FAQs

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        Blog, Metal Etching, Photo Etching

        Wet Chemical Etching Gallium Nitride (GaN)

        Gallium Nitride (GaN) is a semiconductor material that has gained significant attention in recent years due to its exceptional electronic properties. Its wide bandgap, high electron mobility, and thermal conductivity make it a promising material for high-power and high-frequency electronic devices.

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        Metal Etching
        GaN etching production facility

        Gallium Nitride Characteristics:

        Gallium Nitride possesses several key properties that contribute to its growing applications in the semiconductor industry:

        1. Wide Bandgap: Gallium Nitride has a wide bandgap of approximately 3.4 eV, enabling it to handle high voltages and operate at high temperatures.
        2. High Electron Mobility: GaN exhibits high electron mobility, making it suitable for high-frequency and high-power electronic devices.
        3. Thermal Conductivity: Gallium Nitride has excellent thermal conductivity, allowing it to dissipate heat efficiently.
        4. Stability: GaN is chemically stable, providing durability in harsh environments.

        Metal Etching Gallium Nitride:

        Metal etching is a precise process used to selectively remove material from the surface of Gallium Nitride to create intricate patterns and designs. When etching Gallium Nitride, the choice of etchant is critical for achieving optimal results:

        1. Inductively Coupled Plasma (ICP) Dry Etching: ICP dry etching is a common method for etching GaN. Gases such as chlorine (Cl2), bromine (Br2), and sulfur hexafluoride (SF6) are used in ICP etching processes to react with GaN, selectively removing material. The choice of gas depends on the specific etch rate and selectivity requirements.
        2. Reactive Ion Etching (RIE): RIE is another dry etching technique used for GaN. It involves using reactive gases, such as chlorine or fluorine-based compounds, in a low-pressure plasma to etch the GaN surface selectively.
        3. Plasma Etching: Plasma etching using various gases can be used for precise and controlled etching of GaN. Common gases used include SF6 and O2, which can create a chemically reactive plasma to etch GaN.
        4. Hot Phosphoric Acid (H3PO4): Hot phosphoric acid can be used for wet etching of GaN. It is a selective etchant that can remove GaN while leaving other materials intact. However, it requires high-temperature conditions and can be corrosive.
        5. Potassium Hydroxide (KOH): KOH can also be used as a wet etchant for GaN. It’s a more gentle etchant compared to hot phosphoric acid and is often used for slower, isotropic etching.
        6. Hydrochloric Acid (HCl): Dilute hydrochloric acid solutions can be used for wet etching of GaN under certain conditions. The selectivity and etch rate can be controlled by adjusting the acid concentration and temperature.
        7. Eutectic Alloy: In some cases, eutectic alloys like gold-gallium (Au-Ga) or gold-indium (Au-In) may be used to selectively bond to GaN, and subsequent removal of the alloy can result in selective etching.

        Gan etching equipment

        Wet Chemical S650 Gan Etching Machine

        Selling Price:
        $12,000.00

        S650 WET Etching MachineDownload

        Wet Processing Equipment – Gan etching machine

        The Gan etching machine is used to spray chemical solution to a copper-clad laminator, aluminum substrate, or stainless steel plate, the exposed copper, aluminum, and stainless steel are etched away, retaining the pattern or circuit covered by the corrosion-proof film, so as to achieve the purpose of making pattern or circuit.

        This etching machine is an all-in-one small Gan etching machine that is easy to install and can be used immediately after powering on.

        Photo Etching Gallium Nitride:

        Photo etching is a precise process used for intricate designs on Gallium Nitride:

        1. Material Film: Photomasks made of high-quality polymer films with excellent UV resistance are recommended for precise and detailed etching.
        2. Temperature Control: Maintain a stable and controlled temperature during the photoresist exposure and development process to ensure accurate pattern transfer.

        Gallium Nitride’s exceptional electronic properties make it a promising material for high-power and high-frequency electronic devices. By understanding the etchants, surface treatment methods, electroforming techniques, metal cleaning, and photo etching processes for Gallium Nitride, manufacturers can achieve exceptional results without compromising the material’s integrity. Applying these insights will enable the production of high-quality Gallium Nitride devices with enhanced performance for diverse semiconductor applications.

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        how to etch Gallium Nitride (GaN)?

        Etching Gallium Nitride (GaN) Processing Guidelines

        MaterialEtchantTemperature (°C)Concentration (%)Estimated Etch Depth (microns)Etch Quality
        Etching Gallium NitrideReactive Ion Etching (RIE)Room temperatureN/AVariable depth, controlled by RIE processHigh-quality (precise)
        Etching Gallium NitrideHot Phosphoric Acid (H3PO4)160-18085%1-10High-quality (smooth)
        Etching Gallium NitridePotassium Hydroxide (KOH)80-10030%0.5-5High-quality (smooth)
        Etching Gallium NitrideHydrochloric Acid (HCl)Room temperature10%1-10Moderate-quality (etched)
        Etching Gallium Nitride (GaN) Processing Guidelines

        Please note that the estimated etch depths and etch quality may vary based on factors such as exposure time, agitation, and the specific etching conditions, particularly in the case of Reactive Ion Etching (RIE). RIE is a specialized process, and the etch depth is controlled differently compared to wet chemical etching. Always conduct test etches and adjust parameters as needed to achieve your desired results. Additionally, safety precautions should be followed when handling these chemicals, particularly the use of appropriate personal protective equipment.

        If you have metal wet etching GaN needs, please feel free to contact us.

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          Blog, Metal Etching, Photo Etching

          Wet Chemical Etching Indium

          Indium, a soft and malleable metal, is known for its unique properties, including high thermal and electrical conductivity, low melting point, and excellent solderability.

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          Wet Metal Etching Production workshop- Shenzhen Xinxin Precision Equipment Co., Ltd.
          Indium etching production facility

          Indium Characteristics:

          Indium possesses several key properties that contribute to its wide-ranging applications:

          1. Low Melting Point: Indium’s low melting point of 156.6°C (313.9°F) allows it to be easily shaped and used in soldering applications.
          2. Softness and Malleability: Indium is a soft and malleable metal, making it easy to form into intricate shapes.
          3. High Thermal Conductivity: Indium exhibits excellent thermal conductivity, making it suitable for heat dissipation in electronic devices.
          4. Electrical Conductivity: Indium is an excellent electrical conductor, further enhancing its applications in the electronics industry.

          Metal Etching Indium:

          Metal etching is a precise process used to selectively remove material from the surface of indium to create intricate patterns and designs. When etching indium, the choice of etchant is critical for achieving optimal results:

          1. Nitric Acid (HNO3) Solution: Advantages: Nitric acid can be used for controlled etching of indium, offering precise pattern transfer.
          2. Hydrochloric Acid (HCl) Solution: Advantages: HCl solution is effective for etching indium due to its ability to dissolve the oxide layer.
          3. Aqua Regia: Advantages: Aqua regia, a mixture of nitric and hydrochloric acid, is suitable for aggressive etching of indium.

          Indium etching equipment

          Wet Chemical S650 Indium Etching Machine

          Selling Price:
          $12,000.00

          S650 WET Etching MachineDownload

          Wet Processing Equipment – Indium etching machine

          The Indium etching machine is used to spray chemical solution to a copper-clad laminator, aluminum substrate, or stainless steel plate, the exposed copper, aluminum, and stainless steel are etched away, retaining the pattern or circuit covered by the corrosion-proof film, so as to achieve the purpose of making pattern or circuit.

          This etching machine is an all-in-one small Indium etching machine that is easy to install and can be used immediately after powering on.

          Photo Etching Indium:

          Photo etching is a precise process used for intricate designs on indium:

          1. Material Film: Photomasks made of high-quality polymer films with excellent UV resistance are recommended for precise and detailed etching.
          2. Temperature Control: Maintain a stable and controlled temperature during the photoresist exposure and development process to ensure accurate pattern transfer.

          Indium’s unique properties make it a valuable material for precision machining, especially in electronics and semiconductors. By understanding the etchants, surface treatment methods, electroforming techniques, metal cleaning, and photo etching processes for indium, manufacturers can achieve exceptional results without compromising the material’s integrity. Applying these insights will enable the production of high-quality indium products tailored to specific applications, ranging from electronic components to soldering materials and beyond.

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          how to etch Indium?

          Etching Indium Processing Guide

          MetalEtchantTemperature (°C)Concentration (%)Estimated Etch Depth (microns)Etch Quality
          Etching IndiumNitric Acid (HNO3)Room temperature10-15% HNO32-10High-quality (smooth)
          Etching IndiumHydrochloric Acid (HCl)Room temperature10-15% HCl2-10High-quality (smooth)
          Etching IndiumAqua RegiaRoom temperature1:3 HNO3 to HCl2-10High-quality (smooth)
          Etching Indium Processing Guide

          The values provided are approximate and can vary depending on specific etching conditions, including exposure time and the condition of the indium surface. Always conduct test etches and adjust parameters as needed to achieve your desired results. Additionally, safety precautions should be followed when handling these chemicals, particularly in the case of Aqua Regia.

          If you have metal wet etching Indium needs, please feel free to contact us.

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