The Automatic Dry Film Laminator (WET-IM-02) is a imaging & photo process system engineered for printed-circuit-board fabrication. Each unit is configured around your panel size, throughput target, and automation level rather than sold as a fixed catalog item, so the specification reflects the work it actually has to do on your line.
Where the Automatic Dry Film Laminator Fits in the Process
In a PCB line the Automatic Dry Film Laminator sits in the imaging & photo process area. Correct integration with the steps before and after it is what protects overall yield, cycle time, and cost per panel, so it is specified as part of the wider flow rather than in isolation.
Design Highlights
- Designed for low maintenance, fast changeover and high equipment uptime.
- High-resolution exposure for fine line and space definition.
- Vacuum draw-down for intimate film-to-panel contact.
- Registration alignment to hold layer-to-layer accuracy.
- Recipe management and process logging via the plc + hmi touchscreen.
Where It Is Used
Used to transfer circuit patterns for rigid, flex and HDI boards, including fine-feature and high-density designs.
Build and Support
The Automatic Dry Film Laminator is assembled and tested in-house. Electrical, air, water, and exhaust requirements are detailed in the installation drawing issued before delivery. After commissioning we provide process guidance and spares documentation to keep uptime high.
Request a Quotation
Tell us your panel size, throughput, and automation requirements for the Automatic Dry Film Laminator. Our engineers will respond with a tailored configuration and price, usually within one business day.
Frequently Asked Questions
Can the Automatic Dry Film Laminator be customised for our process?
What throughput can the Automatic Dry Film Laminator achieve?
What is the maximum panel or workpiece size for the Automatic Dry Film Laminator?
What lead time and support come with the Automatic Dry Film Laminator?
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- IPC-A-600: Acceptability of Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.

