The CCD Solder Mask Exposure Machine (WET-SM-03) handles a defined step in the PCB process flow as part of the solder mask & printing group. It is normally specified together with the cells immediately upstream and downstream of it, which is where most of the yield and cycle-time gains actually come from.
Where the CCD Solder Mask Exposure Machine Fits in the Process
In a PCB line the CCD Solder Mask Exposure Machine sits in the solder mask & printing area. Correct integration with the steps before and after it is what protects overall yield, cycle time, and cost per panel, so it is specified as part of the wider flow rather than in isolation.
Key Capabilities
- Fine-feature legend capability for dense boards.
- Recipe management and process logging via the industrial pc + vision/software.
- Supplied as automatic (pc/cnc controlled), with options for line integration.
- Stainless-steel wetted parts and chemically resistant construction where the process requires it.
- Safety interlocks, alarms and guarding designed for a production environment.
Typical Applications
Used to apply and cure solder mask and legend on rigid and flex boards of all complexities.
Configured to Your Line
This is not an off-the-shelf machine. We confirm your panel size, throughput target, and facility services first, then propose a configuration of the CCD Solder Mask Exposure Machine that fits. Installation guidance and commissioning support are included so the line reaches stable output quickly.
Get a Tailored Quote
Send us your production details and we will configure the CCD Solder Mask Exposure Machine to match, then return a specification and quotation. We are happy to advise on integration with your existing line.
Frequently Asked Questions
Can the CCD Solder Mask Exposure Machine be customised for our process?
What lead time and support come with the CCD Solder Mask Exposure Machine?
What are the utility requirements for the CCD Solder Mask Exposure Machine?
What throughput can the CCD Solder Mask Exposure Machine achieve?
Sources & References
- IPC-A-600: Acceptability of Printed Boards
- IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.

