Film Punching Machine

Film Punching Machine

Engineer-configured imaging & photo process equipment for consistent results across rigid, multilayer, and HDI boards.

Imaging & Photo Process
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Description

The Film Punching Machine (WET-IM-07) is a production-grade imaging & photo process system. Rather than a one-size-fits-all unit, it is built to a specification confirmed with your team — panel handling, control software, throughput, and material compatibility are all set to your mix.

Where the Film Punching Machine Fits in the Process

In a PCB line the Film Punching Machine sits in the imaging & photo process area. Correct integration with the steps before and after it is what protects overall yield, cycle time, and cost per panel, so it is specified as part of the wider flow rather than in isolation.

Key Capabilities

  • High-resolution exposure for fine line and space definition.
  • Vacuum draw-down for intimate film-to-panel contact.
  • Registration alignment to hold layer-to-layer accuracy.
  • Recipe management and process logging via the plc + hmi touchscreen.
  • Supplied as semi-automatic, with options for line integration.

Common Use Cases

Used to transfer circuit patterns for rigid, flex and HDI boards, including fine-feature and high-density designs.

Configured to Your Line

This is not an off-the-shelf machine. We confirm your panel size, throughput target, and facility services first, then propose a configuration of the Film Punching Machine that fits. Installation guidance and commissioning support are included so the line reaches stable output quickly.

Enquire About the Film Punching Machine

Let us know what the Film Punching Machine needs to do on your line. We will confirm the configuration, throughput, and price, and outline how it integrates with the surrounding stages.

Frequently Asked Questions

What throughput can the Film Punching Machine achieve?
Typical throughput is 30-60 panels/hour. Actual figures depend on material thickness, feature density, and the quality target, so treat the rated value as a planning baseline rather than a guarantee.
Which materials or board types does the Film Punching Machine support?
Supported board types include Rigid, multilayer, HDI (flex / rigid-flex optional). Other substrates can often be qualified with a short process trial — send a sample and we will confirm.
What are the utility requirements for the Film Punching Machine?
Electrical supply is specified at 3-phase 380-415 V AC, 50/60 Hz. Compressed air, water, and exhaust connections are detailed in the installation drawing supplied before delivery.
What is the maximum panel or workpiece size for the Film Punching Machine?
This configuration is rated for a maximum panel size of —. Larger or thinner stock can usually be accommodated with tooling changes — confirm the exact window for your job before ordering.

Technical Parameters

ModelWET-IM-07
Maximum panel size
Board types supportedRigid, multilayer, HDI (flex / rigid-flex optional)
Automation levelSemi-automatic
Control systemPLC + HMI touchscreen
Throughput30-60 panels/hour
ResolutionLine/space down to 20-30 µm; registration ±15 µm
Power supply3-phase 380-415 V AC, 50/60 Hz