
Tin Plating Post-Treatment Line
Built-to-spec surface finishing system for fabricators who need repeatable yield and predictable cycle times.
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Engineer-configured surface finishing equipment for consistent results across rigid, multilayer, and HDI boards.
The OSP Coating Line (WET-SF-06) is a surface finishing system engineered for printed-circuit-board fabrication. Each unit is configured around your panel size, throughput target, and automation level rather than sold as a fixed catalog item, so the specification reflects the work it actually has to do on your line.
In a PCB line the OSP Coating Line sits in the surface finishing area. Correct integration with the steps before and after it is what protects overall yield, cycle time, and cost per panel, so it is specified as part of the wider flow rather than in isolation.
Used to apply protective, solderable finishes for boards destined for SMT and through-hole assembly.
The OSP Coating Line can be supplied as a standalone unit or built into an automated line. Panel-size handling, control software, throughput, and material compatibility are configured to your production mix. As a configured-to-order system, the specification is finalized with our engineers before quotation.
Let us know what the OSP Coating Line needs to do on your line. We will confirm the configuration, throughput, and price, and outline how it integrates with the surrounding stages.
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
| Model | WET-SF-06 |
|---|---|
| Maximum panel size | 610 x 610 mm |
| Board types supported | Rigid, multilayer, HDI (flex / rigid-flex optional) |
| Automation level | Inline / automatic |
| Control system | PLC + HMI touchscreen |
| Throughput | Up to 90 panels/hour |
| Power supply | 3-phase 380-415 V AC, 50/60 Hz |
Besides complete production lines we supply spare parts and consumables for PCB drilling and routing machines: