The Tin Plating Post-Treatment Line (WET-SF-03) handles a defined step in the PCB process flow as part of the surface finishing group. It is normally specified together with the cells immediately upstream and downstream of it, which is where most of the yield and cycle-time gains actually come from.

Process Position

The Tin Plating Post-Treatment Line operates within the surface finishing section of the line. Getting the hand-off to the neighbouring cells right matters more to throughput than the headline rating of any single machine, which is why we size it against your real production sequence.

Design Highlights

• Recipe management and process logging via the plc + hmi touchscreen.
• Supplied as inline / automatic, with options for line integration.
• Stainless-steel wetted parts and chemically resistant construction where the process requires it.
• Safety interlocks, alarms and guarding designed for a production environment.
• Designed for low maintenance, fast changeover and high equipment uptime.

Typical Applications

Used to apply protective, solderable finishes for boards destined for SMT and through-hole assembly.

Configured to Your Line

This is not an off-the-shelf machine. We confirm your panel size, throughput target, and facility services first, then propose a configuration of the Tin Plating Post-Treatment Line that fits. Installation guidance and commissioning support are included so the line reaches stable output quickly.

Talk to Our Engineers

Every Tin Plating Post-Treatment Line is quoted against a real specification, not a list price. Share your requirements and our engineering team will propose a build and confirm pricing and lead time.