Solder Mask & Printing
Dual-Table Screen Printing Machine
Engineer-configured solder mask & printing equipment for consistent results across rigid, multilayer, and HDI boards.
View detailsThe Solder Mask Developing Line (WET-SM-04) handles a defined step in the PCB process flow as part of the solder mask & printing group. It is normally specified together with the cells immediately upstream and downstream of it, which is where most of the yield and cycle-time gains actually come from.
Process Position
The Solder Mask Developing Line operates within the solder mask & printing section of the line. Getting the hand-off to the neighbouring cells right matters more to throughput than the headline rating of any single machine, which is why we size it against your real production sequence.
Design Highlights
- UV curing profile management for full cure without yellowing.
- Fine-feature legend capability for dense boards.
- Recipe management and process logging via the plc + hmi touchscreen.
- Supplied as inline / automatic, with options for line integration.
- Stainless-steel wetted parts and chemically resistant construction where the process requires it.
Where It Is Used
Used to apply and cure solder mask and legend on rigid and flex boards of all complexities.
Build and Support
The Solder Mask Developing Line is assembled and tested in-house. Electrical, air, water, and exhaust requirements are detailed in the installation drawing issued before delivery. After commissioning we provide process guidance and spares documentation to keep uptime high.
Get a Tailored Quote
Send us your production details and we will configure the Solder Mask Developing Line to match, then return a specification and quotation. We are happy to advise on integration with your existing line.
Frequently Asked Questions
What throughput can the Solder Mask Developing Line achieve?
Typical throughput is Up to 90 panels/hour. Actual figures depend on material thickness, feature density, and the quality target, so treat the rated value as a planning baseline rather than a guarantee.
How is the Solder Mask Developing Line controlled and operated?
Control is handled by PLC + HMI touchscreen. Operators set recipes through the interface, and process values are logged for traceability and repeatability.
What are the utility requirements for the Solder Mask Developing Line?
Electrical supply is specified at 3-phase 380-415 V AC, 50/60 Hz. Compressed air, water, and exhaust connections are detailed in the installation drawing supplied before delivery.
What does the Solder Mask Developing Line do in the production line?
The Solder Mask Developing Line performs a dedicated step in PCB fabrication. Correct placement relative to the upstream and downstream stages is what protects overall yield, cycle time, and cost per panel, so it is normally specified together with the cells immediately before and after it.
Sources & References
- IPC-A-600: Acceptability of Printed Boards
- IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
