The Solder Mask Developing Line (WET-SM-04) handles a defined step in the PCB process flow as part of the solder mask & printing group. It is normally specified together with the cells immediately upstream and downstream of it, which is where most of the yield and cycle-time gains actually come from.

Process Position

The Solder Mask Developing Line operates within the solder mask & printing section of the line. Getting the hand-off to the neighbouring cells right matters more to throughput than the headline rating of any single machine, which is why we size it against your real production sequence.

Design Highlights

• UV curing profile management for full cure without yellowing.
• Fine-feature legend capability for dense boards.
• Recipe management and process logging via the plc + hmi touchscreen.
• Supplied as inline / automatic, with options for line integration.
• Stainless-steel wetted parts and chemically resistant construction where the process requires it.

Where It Is Used

Used to apply and cure solder mask and legend on rigid and flex boards of all complexities.

Build and Support

The Solder Mask Developing Line is assembled and tested in-house. Electrical, air, water, and exhaust requirements are detailed in the installation drawing issued before delivery. After commissioning we provide process guidance and spares documentation to keep uptime high.

Get a Tailored Quote

Send us your production details and we will configure the Solder Mask Developing Line to match, then return a specification and quotation. We are happy to advise on integration with your existing line.