
Vertical Continuous Plating (VCP) Line, 20 Cells
Engineer-configured plating & metallization equipment for consistent results across rigid, multilayer, and HDI boards.
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A configured-to-order plating & metallization system for PCB production lines, built and supported in-house.
As a plating & metallization machine, the Black Hole Direct Metallization Line (WET-PL-01) is intended for fabricators who need repeatable output and predictable cost per panel. The system is assembled and tested in-house, then integrated to match the rest of your production line.
In a PCB line the Black Hole Direct Metallization Line sits in the plating & metallization area. Correct integration with the steps before and after it is what protects overall yield, cycle time, and cost per panel, so it is specified as part of the wider flow rather than in isolation.
Used to metallize holes and build copper for multilayer, HDI and heavy-copper boards.
Because every Black Hole Direct Metallization Line is built to order, the exact configuration — conveyor width, tooling, control options, and surrounding handling — is agreed before the build starts. Lead time is confirmed once the specification is fixed, along with commissioning support and spare-parts documentation.
Let us know what the Black Hole Direct Metallization Line needs to do on your line. We will confirm the configuration, throughput, and price, and outline how it integrates with the surrounding stages.
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
| Model | WET-PL-01 |
|---|---|
| Maximum panel size | 610 x 610 mm |
| Board types supported | Rigid, multilayer, HDI (flex / rigid-flex optional) |
| Automation level | Inline / automatic |
| Control system | PLC + HMI touchscreen |
| Throughput | Up to 90 panels/hour |
| Power supply | 3-phase 380-415 V AC, 50/60 Hz |
Besides complete production lines we supply spare parts and consumables for PCB drilling and routing machines: