The Vertical Continuous Plating (VCP) Line, 20 Cells (WET-PL-02) is a production-grade plating & metallization system. Rather than a one-size-fits-all unit, it is built to a specification confirmed with your team — panel handling, control software, throughput, and material compatibility are all set to your mix.

Where the Vertical Continuous Plating (VCP) Line, 20 Cells Fits in the Process

In a PCB line the Vertical Continuous Plating (VCP) Line, 20 Cells sits in the plating & metallization area. Correct integration with the steps before and after it is what protects overall yield, cycle time, and cost per panel, so it is specified as part of the wider flow rather than in isolation.

Features and Capabilities

• Filtration and dosing systems to keep bath chemistry within specification.
• Programmable plating cycles for panel and pattern plating.
• Recipe management and process logging via the plc + hmi touchscreen.
• Supplied as inline / automatic, with options for line integration.
• Stainless-steel wetted parts and chemically resistant construction where the process requires it.

Where It Is Used

Used to metallize holes and build copper for multilayer, HDI and heavy-copper boards.

Configured to Your Line

This is not an off-the-shelf machine. We confirm your panel size, throughput target, and facility services first, then propose a configuration of the Vertical Continuous Plating (VCP) Line, 20 Cells that fits. Installation guidance and commissioning support are included so the line reaches stable output quickly.

Talk to Our Engineers

Every Vertical Continuous Plating (VCP) Line, 20 Cells is quoted against a real specification, not a list price. Share your requirements and our engineering team will propose a build and confirm pricing and lead time.