
Vertical Continuous Plating (VCP) Line, 20 Cells
Engineer-configured plating & metallization equipment for consistent results across rigid, multilayer, and HDI boards.
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A configured-to-order plating & metallization system for PCB production lines, built and supported in-house.
The Pre-Plating Treatment Line (WET-PL-03) handles a defined step in the PCB process flow as part of the plating & metallization group. It is normally specified together with the cells immediately upstream and downstream of it, which is where most of the yield and cycle-time gains actually come from.
In a PCB line the Pre-Plating Treatment Line sits in the plating & metallization area. Correct integration with the steps before and after it is what protects overall yield, cycle time, and cost per panel, so it is specified as part of the wider flow rather than in isolation.
Used to metallize holes and build copper for multilayer, HDI and heavy-copper boards.
The Pre-Plating Treatment Line is assembled and tested in-house. Electrical, air, water, and exhaust requirements are detailed in the installation drawing issued before delivery. After commissioning we provide process guidance and spares documentation to keep uptime high.
Send us your production details and we will configure the Pre-Plating Treatment Line to match, then return a specification and quotation. We are happy to advise on integration with your existing line.
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
| Model | WET-PL-03 |
|---|---|
| Maximum panel size | 610 x 610 mm |
| Board types supported | Rigid, multilayer, HDI (flex / rigid-flex optional) |
| Automation level | Inline / automatic |
| Control system | PLC + HMI touchscreen |
| Throughput | Up to 90 panels/hour |
| Power supply | 3-phase 380-415 V AC, 50/60 Hz |
Besides complete production lines we supply spare parts and consumables for PCB drilling and routing machines: