The Pre-Plating Treatment Line (WET-PL-03) handles a defined step in the PCB process flow as part of the plating & metallization group. It is normally specified together with the cells immediately upstream and downstream of it, which is where most of the yield and cycle-time gains actually come from.

Where the Pre-Plating Treatment Line Fits in the Process

In a PCB line the Pre-Plating Treatment Line sits in the plating & metallization area. Correct integration with the steps before and after it is what protects overall yield, cycle time, and cost per panel, so it is specified as part of the wider flow rather than in isolation.

Features and Capabilities

• Designed for low maintenance, fast changeover and high equipment uptime.
• Uniform current distribution for consistent copper thickness and throwing power.
• Filtration and dosing systems to keep bath chemistry within specification.
• Programmable plating cycles for panel and pattern plating.
• Recipe management and process logging via the plc + hmi touchscreen.

Where It Is Used

Used to metallize holes and build copper for multilayer, HDI and heavy-copper boards.

Build and Support

The Pre-Plating Treatment Line is assembled and tested in-house. Electrical, air, water, and exhaust requirements are detailed in the installation drawing issued before delivery. After commissioning we provide process guidance and spares documentation to keep uptime high.

Get a Tailored Quote

Send us your production details and we will configure the Pre-Plating Treatment Line to match, then return a specification and quotation. We are happy to advise on integration with your existing line.