Imaging & Photo Process
Film Punching Machine
Engineer-configured imaging & photo process equipment for consistent results across rigid, multilayer, and HDI boards.
View detailsWET specializes in resource integration, including Dry & Wet Process solutions and Testing Machines.like Film punching machine for PCB
Technical Features
Use A Fast Scan Recognition Algorithm,Can Find Target Hole Quickly
Identify Various Target Types Such As Circular Holes And Ring Hole
Frequently Asked Questions
Can the Film Punching Machine be customised for our process?
Yes. Conveyor width, tooling, control options, and the surrounding handling can be adapted to your panel size, throughput target, and facility constraints. Share your specification and we will propose a configuration.
What materials is the Film Punching Machine suitable for?
Material compatibility is confirmed against your substrate during process qualification. A small sample run is the fastest way to validate fit before committing to production.
What is the maximum panel or workpiece size for the Film Punching Machine?
This configuration is rated for a maximum panel size of 1250*770*1000mm. Larger or thinner stock can usually be accommodated with tooling changes — confirm the exact window for your job before ordering.
How is the Film Punching Machine controlled and operated?
Control is handled by Under light source. Operators set recipes through the interface, and process values are logged for traceability and repeatability.
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- IPC-A-600: Acceptability of Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
