Molybdenum H₂O₂(30%)+H₂SO₄(10%)

Chemical Etching Formula
Mo1 Pure Molybdenum with H₂O₂(30%)+H₂SO₄(10%)

Working with Mo1 Pure Molybdenum on a chemical etch line begins with the right formula. The H₂O₂(30%)+H₂SO₄(10%) system documented below produces through etch (double-sided) across 0.05-0.3 mm sheet, with a minimum hole-diameter range of 60-360 μm and a minimum line-width range of 100-300 μm. The numbers scale with thickness — thinner stock yields finer features.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

H₂O₂(30%)+H₂SO₄(10%) Etchant System
— °Bé Concentration
1.100 Specific Gravity
52 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.3 mm Thickness Range
0.15 mm Typical Thickness
0.12-1.11 m/min Conveyor Speed Range
0.22 m/min Typical Speed
60-360 μm Min Hole Ø Range
100-300 μm Min Line Width Range
11-64 μm Undercut Range
2.35 Etch Factor (EF)
93.7% Typical Yield (93.2-93.9%)

Why H₂O₂(30%)+H₂SO₄(10%) for Mo1 Pure Molybdenum?

The H₂O₂(30%)+H₂SO₄(10%) formula is selected for Mo1 Pure Molybdenum because it balances oxidation rate, surface chemistry, and bath stability for this alloy class. Chemistries that etch too aggressively create excessive undercut and rough sidewalls; chemistries that are too mild require impractically long dwell times or attack the photoresist. H₂O₂(30%)+H₂SO₄(10%) sits in the productive middle for Mo1 Pure Molybdenum, which is why it appears in this reference set.

Process Window & Bath Control

The process window for this H₂O₂(30%)+H₂SO₄(10%) formula centres on 52°C and as specified. Conveyor speed spans 0.12-1.11 m/min over the 0.05-0.3 mm thickness band; the typical operating point is 0.22 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 60-360 μm, line width 100-300 μm, single-side undercut 11-64 μm — all as a function of thickness across 0.05-0.3 mm. The higher the etch factor (this formula holds about 2.35), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Design Rule Summary
• Minimum hole diameter range: 60-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 11-64 μm
• Typical etch factor (EF): 2.35

Yield & Production Economics

Expect a yield in the 93.2-93.9% range for Mo1 Pure Molybdenum with H₂O₂(30%)+H₂SO₄(10%), with 93.7% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Parts produced with the H₂O₂(30%)+H₂SO₄(10%) formula on Mo1 Pure Molybdenum are common in semiconductor lead frames, sputtering masks, and high-temperature electrode grids. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

More Molybdenum Formulas

Other formulas in the same material family.

TZM Molybdenum Alloy H₂O₂(30%)+H₂SO₄(10%) Through etch (double-sided)

Frequently Asked Questions

Minimum line width ranges 100-300 μm over the supported thickness range, per the 1.0× thickness rule. At the fine end, photoresist resolution and adhesion — not the etchant — become the limiting factors, so resist selection matters as much as bath chemistry.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the H₂O₂(30%)+H₂SO₄(10%) chemistry. Send us your part drawing and quantity for a full process quote.

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