Molybdenum H₂O₂(30%)+H₂SO₄(10%)

Chemical Etching Formula
TZM Molybdenum Alloy with H₂O₂(30%)+H₂SO₄(10%)

For engineers selecting an etching chemistry for TZM Molybdenum Alloy, the H₂O₂(30%)+H₂SO₄(10%) formula shown here defines the bath composition, temperature window, and achievable feature sizes across a 0.05-0.3 mm thickness band. Typical mass-production yield for this recipe is 93.7%, with a typical conveyor speed of 0.22 m/min at 55°C.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

H₂O₂(30%)+H₂SO₄(10%) Etchant System
— °Bé Concentration
1.100 Specific Gravity
55 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.3 mm Thickness Range
0.15 mm Typical Thickness
0.12-1.11 m/min Conveyor Speed Range
0.22 m/min Typical Speed
60-360 μm Min Hole Ø Range
100-300 μm Min Line Width Range
11-65 μm Undercut Range
2.30 Etch Factor (EF)
93.7% Typical Yield (93.2-93.9%)

Why H₂O₂(30%)+H₂SO₄(10%) for TZM Molybdenum Alloy?

H₂O₂(30%)+H₂SO₄(10%) earns its place as a TZM Molybdenum Alloy etching formula through repeatability. The bath can be titrated and corrected each shift to hold concentration (as specified) and specific gravity (1.100) within a tight band, which keeps the etch factor near 2.30 and yield near 93.7% run after run.

Process Window & Bath Control

Bath control for TZM Molybdenum Alloy in H₂O₂(30%)+H₂SO₄(10%): temperature 55°C, concentration as specified, specific gravity 1.100. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-1.11 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 60-360 μm, line width 100-300 μm, single-side undercut 11-65 μm — all as a function of thickness across 0.05-0.3 mm. The higher the etch factor (this formula holds about 2.30), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Design Rule Summary
• Minimum hole diameter range: 60-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 11-65 μm
• Typical etch factor (EF): 2.30

Yield & Production Economics

Expect a yield in the 93.2-93.9% range for TZM Molybdenum Alloy with H₂O₂(30%)+H₂SO₄(10%), with 93.7% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Parts produced with the H₂O₂(30%)+H₂SO₄(10%) formula on TZM Molybdenum Alloy are common in semiconductor lead frames, sputtering masks, and high-temperature electrode grids. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

More Molybdenum Formulas

Other formulas in the same material family.

Mo1 Pure Molybdenum H₂O₂(30%)+H₂SO₄(10%) Through etch (double-sided)

Frequently Asked Questions

Typical inspection on TZM Molybdenum Alloy etched with H₂O₂(30%)+H₂SO₄(10%) includes optical checks for unetched residue and surface defects, dimensional metrology on critical features, and edge-quality assessment. Final dimensional tolerance is usually ±10% of the smallest critical feature or ±25 μm, whichever is larger.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the H₂O₂(30%)+H₂SO₄(10%) chemistry. Send us your part drawing and quantity for a full process quote.

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