Built for the lamination & multilayer stage of PCB manufacturing, the Inner Layer Fusion (Lay-up) Machine (WET-LM-04) is designed to hold consistent quality across rigid, multilayer, and HDI boards. Because it is configured to order, the final build is agreed with our engineers before any quotation is issued.

How It Works in Production

During the lamination & multilayer stage the Inner Layer Fusion (Lay-up) Machine processes each panel to a repeatable standard. Process values are driven by recipe, so results stay consistent across shifts and operators rather than depending on manual judgement.

What It Delivers

• Registration systems to hold inner-layer alignment.
• Recipe management and process logging via the plc + hmi touchscreen.
• Supplied as semi-automatic, with options for line integration.
• Stainless-steel wetted parts and chemically resistant construction where the process requires it.
• Safety interlocks, alarms and guarding designed for a production environment.

Common Use Cases

Used to bond inner layers into multilayer and HDI stacks for telecom, computing and automotive boards.

Configured to Your Line

This is not an off-the-shelf machine. We confirm your panel size, throughput target, and facility services first, then propose a configuration of the Inner Layer Fusion (Lay-up) Machine that fits. Installation guidance and commissioning support are included so the line reaches stable output quickly.

Talk to Our Engineers

Every Inner Layer Fusion (Lay-up) Machine is quoted against a real specification, not a list price. Share your requirements and our engineering team will propose a build and confirm pricing and lead time.