The Polished Lamination Steel Plates (WET-LM-06) is a production-grade lamination & multilayer system. Rather than a one-size-fits-all unit, it is built to a specification confirmed with your team — panel handling, control software, throughput, and material compatibility are all set to your mix.
Line Integration
This lamination & multilayer system is designed to slot into a conveyorized, automated line or run as a standalone cell. The interfaces to upstream loading and downstream handling are configured so material moves cleanly through the lamination & multilayer step without bottlenecks.
Design Highlights
- Safety interlocks, alarms and guarding designed for a production environment.
- Designed for low maintenance, fast changeover and high equipment uptime.
- Programmable temperature and pressure profiles for void-free lamination.
- Vacuum lamination for resin flow control on multilayer stacks.
- Registration systems to hold inner-layer alignment.
Common Use Cases
Used to bond inner layers into multilayer and HDI stacks for telecom, computing and automotive boards.
Configuration and Ordering
The Polished Lamination Steel Plates can be supplied as a standalone unit or built into an automated line. Panel-size handling, control software, throughput, and material compatibility are configured to your production mix. As a configured-to-order system, the specification is finalized with our engineers before quotation.
Enquire About the Polished Lamination Steel Plates
Let us know what the Polished Lamination Steel Plates needs to do on your line. We will confirm the configuration, throughput, and price, and outline how it integrates with the surrounding stages.
Frequently Asked Questions
What is the maximum panel or workpiece size for the Polished Lamination Steel Plates?
How is the Polished Lamination Steel Plates controlled and operated?
What throughput can the Polished Lamination Steel Plates achieve?
Can the Polished Lamination Steel Plates be customised for our process?
Sources & References
- IPC-A-600: Acceptability of Printed Boards
- IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.

