
Brown Oxide Line
A configured-to-order lamination & multilayer system for PCB production lines, built and supported in-house.
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Engineer-configured lamination & multilayer equipment for consistent results across rigid, multilayer, and HDI boards.
The Polished Lamination Steel Plates (WET-LM-06) is a production-grade lamination & multilayer system. Rather than a one-size-fits-all unit, it is built to a specification confirmed with your team — panel handling, control software, throughput, and material compatibility are all set to your mix.
This lamination & multilayer system is designed to slot into a conveyorized, automated line or run as a standalone cell. The interfaces to upstream loading and downstream handling are configured so material moves cleanly through the lamination & multilayer step without bottlenecks.
Used to bond inner layers into multilayer and HDI stacks for telecom, computing and automotive boards.
The Polished Lamination Steel Plates can be supplied as a standalone unit or built into an automated line. Panel-size handling, control software, throughput, and material compatibility are configured to your production mix. As a configured-to-order system, the specification is finalized with our engineers before quotation.
Let us know what the Polished Lamination Steel Plates needs to do on your line. We will confirm the configuration, throughput, and price, and outline how it integrates with the surrounding stages.
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
| Model | WET-LM-06 |
|---|---|
| Maximum panel size | 610 x 610 mm |
| Board types supported | Rigid, multilayer, HDI (flex / rigid-flex optional) |
| Automation level | Semi-automatic |
| Control system | PLC + HMI touchscreen |
| Throughput | 30-60 panels/hour |
| Power supply | 3-phase 380-415 V AC, 50/60 Hz |
Besides complete production lines we supply spare parts and consumables for PCB drilling and routing machines: