Built for the lamination & multilayer stage of PCB manufacturing, the Pinning Machine (WET-LM-02) is designed to hold consistent quality across rigid, multilayer, and HDI boards. Because it is configured to order, the final build is agreed with our engineers before any quotation is issued.

Line Integration

This lamination & multilayer system is designed to slot into a conveyorized, automated line or run as a standalone cell. The interfaces to upstream loading and downstream handling are configured so material moves cleanly through the lamination & multilayer step without bottlenecks.

What It Delivers

• Designed for low maintenance, fast changeover and high equipment uptime.
• Programmable temperature and pressure profiles for void-free lamination.
• Vacuum lamination for resin flow control on multilayer stacks.
• Registration systems to hold inner-layer alignment.
• Recipe management and process logging via the plc + hmi touchscreen.

Common Use Cases

Used to bond inner layers into multilayer and HDI stacks for telecom, computing and automotive boards.

Configured to Your Line

This is not an off-the-shelf machine. We confirm your panel size, throughput target, and facility services first, then propose a configuration of the Pinning Machine that fits. Installation guidance and commissioning support are included so the line reaches stable output quickly.

Enquire About the Pinning Machine

Let us know what the Pinning Machine needs to do on your line. We will confirm the configuration, throughput, and price, and outline how it integrates with the surrounding stages.