Built for the lamination & multilayer stage of PCB manufacturing, the Ring Setting (Riveting) Machine (WET-LM-01) is designed to hold consistent quality across rigid, multilayer, and HDI boards. Because it is configured to order, the final build is agreed with our engineers before any quotation is issued.

Process Position

The Ring Setting (Riveting) Machine operates within the lamination & multilayer section of the line. Getting the hand-off to the neighbouring cells right matters more to throughput than the headline rating of any single machine, which is why we size it against your real production sequence.

Design Highlights

• Stainless-steel wetted parts and chemically resistant construction where the process requires it.
• Safety interlocks, alarms and guarding designed for a production environment.
• Designed for low maintenance, fast changeover and high equipment uptime.
• Programmable temperature and pressure profiles for void-free lamination.
• Vacuum lamination for resin flow control on multilayer stacks.

Where It Is Used

Used to bond inner layers into multilayer and HDI stacks for telecom, computing and automotive boards.

Configured to Your Line

This is not an off-the-shelf machine. We confirm your panel size, throughput target, and facility services first, then propose a configuration of the Ring Setting (Riveting) Machine that fits. Installation guidance and commissioning support are included so the line reaches stable output quickly.

Request a Quotation

Tell us your panel size, throughput, and automation requirements for the Ring Setting (Riveting) Machine. Our engineers will respond with a tailored configuration and price, usually within one business day.