Features
◆ Use High Precision HINWIN Linear Guide
◆ Spindle Speed 60000rpm /40000rpm
◆ Drilling Offset Accuracy Is ≤0.02mm
◆ Can Drilling Single Side,Double Side /Multi Layer PCB,MCPCB
Frequently Asked Questions
What lead time and support come with the SEMI-AUTOMATIC Target Hole Drilling Machine WET-ZB2530?
Lead time is quoted per order once the configuration is fixed. Installation guidance, commissioning support, and spare-parts documentation are provided so the line reaches stable output quickly.
Which materials or board types does the SEMI-AUTOMATIC Target Hole Drilling Machine WET-ZB2530 support?
Supported board types include 0.2-3.0mm. Other substrates can often be qualified with a short process trial — send a sample and we will confirm.
How is throughput determined for the SEMI-AUTOMATIC Target Hole Drilling Machine WET-ZB2530?
Throughput depends on material thickness, feature density, and the inspection target. We size the machine against your real production mix rather than a single nominal number.
What are the utility requirements for the SEMI-AUTOMATIC Target Hole Drilling Machine WET-ZB2530?
Electrical supply is specified at 220V±10% 1.5KVA. Compressed air, water, and exhaust connections are detailed in the installation drawing supplied before delivery.
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- IPC-A-600: Acceptability of Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
