Wet Chemical Etching Parameter Database
A live reference of production-validated wet chemical etching parameters for 128+ alloy grades across 10 etchant chemistries. Each of the 1,000 rows below links to a dedicated detail page with process narrative, design rules, applications, and a unique FAQ.
1,000 Data Points
128+ Alloy Grades
10 Etchant Systems
96.9% Avg Yield
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Parameter Table — Click Any Row to Open Detail Page
| Material | Thick. mm | Etchant | °Bé | T °C | Speed m/min | Depth | Min Ø μm | Min W μm | Undercut μm | EF | Yield |
|---|---|---|---|---|---|---|---|---|---|---|---|
| Loading parameters… | |||||||||||
Select a material and thickness to view validated process parameters.
Frequently Asked Questions
Wet chemical etching is a subtractive manufacturing process that uses liquid chemical solutions to selectively remove material from a metal sheet. A photoresist mask is first applied; the unprotected metal is then dissolved by the etchant in a conveyor spray system. The result is a burr-free, stress-free precision part.
This database covers 130+ alloy grades including stainless steel, aluminum alloys, copper and brass, titanium, nickel and superalloys, tungsten, molybdenum, tantalum, and precious metals.
The etch factor is the ratio of vertical etch depth to lateral undercut. Higher EF means tighter feature tolerance. Standard FeCl₃ processes typically achieve EF 2.5–3.2.
Minimum hole diameter is ≥1.2× material thickness; minimum line width is ≥1.0× thickness. Thinner sheets allow finer features.