Chemical Etching Formula
W-Ni-Fe Tungsten Alloy
with H₂O₂(30%)+NH₃(25%)
Formula Summary
The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.
Why H₂O₂(30%)+NH₃(25%) for W-Ni-Fe Tungsten Alloy?
H₂O₂(30%)+NH₃(25%) earns its place as a W-Ni-Fe Tungsten Alloy etching formula through repeatability. The bath can be titrated and corrected each shift to hold concentration (as specified) and specific gravity (1.120) within a tight band, which keeps the etch factor near 2.28 and yield near 93.1% run after run.
Process Window & Bath Control
Bath control for W-Ni-Fe Tungsten Alloy in H₂O₂(30%)+NH₃(25%): temperature 58°C, concentration as specified, specific gravity 1.120. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-0.98 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.
Design Rules & Tolerances
When laying out artwork for W-Ni-Fe Tungsten Alloy at through etch (double-sided), plan for a minimum hole diameter in the 60-360 μm range and a minimum line width in the 100-300 μm range, depending on the chosen sheet thickness within 0.05-0.3 mm. The etch factor of ~2.28 and undercut range of 11-66 μm determine how much the mask must be biased to land the finished dimension on target.
• Minimum hole diameter range: 60-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 11-66 μm
• Typical etch factor (EF): 2.28
Yield & Production Economics
Expect a yield in the 92.8-93.4% range for W-Ni-Fe Tungsten Alloy with H₂O₂(30%)+NH₃(25%), with 93.1% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.
Typical Applications
Parts produced with the H₂O₂(30%)+NH₃(25%) formula on W-Ni-Fe Tungsten Alloy are common in X-ray collimator grids, electron-beam apertures, and high-density precision masks. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.
Process Equipment & Material Reference
Process equipment for the W-Ni-Fe Tungsten Alloy / H₂O₂(30%)+NH₃(25%) combination is built around our biomedical blade etching machine platform — closed-loop temperature control, redundant pump headers, and metering for bath replenishment all directly affect the etch factor and yield numbers cited on this page.
The Tungsten chemical etching guide reference goes one level above the recipe shown here, surveying the full thickness range, depth options, and common subgrades we run for tungsten.
Production Use Cases for This Formula
Parts produced with this W-Ni-Fe Tungsten Alloy + H₂O₂(30%)+NH₃(25%) formula end up in a wide range of finished products. Representative production runs we have completed using this exact recipe family include tea-infuser custom filter etching, cold-press juicer filtration mesh, and stainless steel metal filter mesh. Each case shares the same root sensitivity: clean photoresist edges, a tightly held bath SG of 1.120, and a conveyor speed inside the 0.12-0.98 m/min envelope.
If your part falls into one of these classes — or a closely adjacent one — this formula is usually the right starting point. We confirm fit with a short sample run on the actual sheet stock before locking in mask artwork.
More Tungsten Formulas
Other formulas in the same material family.
Frequently Asked Questions
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- ASTM B912: Standard Specification for Passivation of Stainless Steels
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
Need a Quote for This Process?
WET Etched runs production wet chemical etching lines using the H₂O₂(30%)+NH₃(25%) chemistry. Send us your part drawing and quantity for a full process quote.
