Tungsten H₂O₂(30%)+NH₃(25%)

Chemical Etching Formula
W-Ni-Fe Tungsten Alloy with H₂O₂(30%)+NH₃(25%)

Working with W-Ni-Fe Tungsten Alloy on a chemical etch line begins with the right formula. The H₂O₂(30%)+NH₃(25%) system documented below produces through etch (double-sided) across 0.05-0.3 mm sheet, with a minimum hole-diameter range of 60-360 μm and a minimum line-width range of 100-300 μm. The numbers scale with thickness — thinner stock yields finer features.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

H₂O₂(30%)+NH₃(25%) Etchant System
°Bé Concentration
1.120 Specific Gravity
58 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.3 mm Thickness Range
0.15 mm Typical Thickness
0.12-0.98 m/min Conveyor Speed Range
0.20 m/min Typical Speed
60-360 μm Min Hole Ø Range
100-300 μm Min Line Width Range
11-66 μm Undercut Range
2.28 Etch Factor (EF)
93.1% Typical Yield (92.8-93.4%)

Why H₂O₂(30%)+NH₃(25%) for W-Ni-Fe Tungsten Alloy?

H₂O₂(30%)+NH₃(25%) earns its place as a W-Ni-Fe Tungsten Alloy etching formula through repeatability. The bath can be titrated and corrected each shift to hold concentration (as specified) and specific gravity (1.120) within a tight band, which keeps the etch factor near 2.28 and yield near 93.1% run after run.

Process Window & Bath Control

Bath control for W-Ni-Fe Tungsten Alloy in H₂O₂(30%)+NH₃(25%): temperature 58°C, concentration as specified, specific gravity 1.120. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-0.98 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.

Design Rules & Tolerances

When laying out artwork for W-Ni-Fe Tungsten Alloy at through etch (double-sided), plan for a minimum hole diameter in the 60-360 μm range and a minimum line width in the 100-300 μm range, depending on the chosen sheet thickness within 0.05-0.3 mm. The etch factor of ~2.28 and undercut range of 11-66 μm determine how much the mask must be biased to land the finished dimension on target.

Design Rule Summary
• Minimum hole diameter range: 60-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 11-66 μm
• Typical etch factor (EF): 2.28

Yield & Production Economics

Expect a yield in the 92.8-93.4% range for W-Ni-Fe Tungsten Alloy with H₂O₂(30%)+NH₃(25%), with 93.1% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Parts produced with the H₂O₂(30%)+NH₃(25%) formula on W-Ni-Fe Tungsten Alloy are common in X-ray collimator grids, electron-beam apertures, and high-density precision masks. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

Process Equipment & Material Reference

Process equipment for the W-Ni-Fe Tungsten Alloy / H₂O₂(30%)+NH₃(25%) combination is built around our biomedical blade etching machine platform — closed-loop temperature control, redundant pump headers, and metering for bath replenishment all directly affect the etch factor and yield numbers cited on this page.

The Tungsten chemical etching guide reference goes one level above the recipe shown here, surveying the full thickness range, depth options, and common subgrades we run for tungsten.

Production Use Cases for This Formula

Parts produced with this W-Ni-Fe Tungsten Alloy + H₂O₂(30%)+NH₃(25%) formula end up in a wide range of finished products. Representative production runs we have completed using this exact recipe family include tea-infuser custom filter etching, cold-press juicer filtration mesh, and stainless steel metal filter mesh. Each case shares the same root sensitivity: clean photoresist edges, a tightly held bath SG of 1.120, and a conveyor speed inside the 0.12-0.98 m/min envelope.

If your part falls into one of these classes — or a closely adjacent one — this formula is usually the right starting point. We confirm fit with a short sample run on the actual sheet stock before locking in mask artwork.

More Tungsten Formulas

Other formulas in the same material family.

Frequently Asked Questions

This formula is documented for a sheet-thickness range of 0.05-0.3 mm, with a typical value of 0.15 mm. Outside this band the same chemistry may still work, but conveyor speed and feature tolerances should be re-verified with a sample run before production.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the H₂O₂(30%)+NH₃(25%) chemistry. Send us your part drawing and quantity for a full process quote.