Tungsten H₂O₂(30%)+NH₃(25%)

Chemical Etching Formula
W-Ni-Fe Tungsten Alloy with H₂O₂(30%)+NH₃(25%)

Working with W-Ni-Fe Tungsten Alloy on a chemical etch line begins with the right formula. The H₂O₂(30%)+NH₃(25%) system documented below produces through etch (double-sided) across 0.05-0.3 mm sheet, with a minimum hole-diameter range of 60-360 μm and a minimum line-width range of 100-300 μm. The numbers scale with thickness — thinner stock yields finer features.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

H₂O₂(30%)+NH₃(25%) Etchant System
— °Bé Concentration
1.120 Specific Gravity
58 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.3 mm Thickness Range
0.15 mm Typical Thickness
0.12-0.98 m/min Conveyor Speed Range
0.20 m/min Typical Speed
60-360 μm Min Hole Ø Range
100-300 μm Min Line Width Range
11-66 μm Undercut Range
2.28 Etch Factor (EF)
93.1% Typical Yield (92.8-93.4%)

Why H₂O₂(30%)+NH₃(25%) for W-Ni-Fe Tungsten Alloy?

H₂O₂(30%)+NH₃(25%) earns its place as a W-Ni-Fe Tungsten Alloy etching formula through repeatability. The bath can be titrated and corrected each shift to hold concentration (as specified) and specific gravity (1.120) within a tight band, which keeps the etch factor near 2.28 and yield near 93.1% run after run.

Process Window & Bath Control

Bath control for W-Ni-Fe Tungsten Alloy in H₂O₂(30%)+NH₃(25%): temperature 58°C, concentration as specified, specific gravity 1.120. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-0.98 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.

Design Rules & Tolerances

When laying out artwork for W-Ni-Fe Tungsten Alloy at through etch (double-sided), plan for a minimum hole diameter in the 60-360 μm range and a minimum line width in the 100-300 μm range, depending on the chosen sheet thickness within 0.05-0.3 mm. The etch factor of ~2.28 and undercut range of 11-66 μm determine how much the mask must be biased to land the finished dimension on target.

Design Rule Summary
• Minimum hole diameter range: 60-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 11-66 μm
• Typical etch factor (EF): 2.28

Yield & Production Economics

Expect a yield in the 92.8-93.4% range for W-Ni-Fe Tungsten Alloy with H₂O₂(30%)+NH₃(25%), with 93.1% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Parts produced with the H₂O₂(30%)+NH₃(25%) formula on W-Ni-Fe Tungsten Alloy are common in X-ray collimator grids, electron-beam apertures, and high-density precision masks. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

More Tungsten Formulas

Other formulas in the same material family.

W-Cu Tungsten Copper H₂O₂(30%)+NH₃(25%) Through etch (double-sided) W1 Pure Tungsten H₂O₂(30%)+NH₃(25%) Through etch (double-sided)

Frequently Asked Questions

This formula is documented for a sheet-thickness range of 0.05-0.3 mm, with a typical value of 0.15 mm. Outside this band the same chemistry may still work, but conveyor speed and feature tolerances should be re-verified with a sample run before production.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the H₂O₂(30%)+NH₃(25%) chemistry. Send us your part drawing and quantity for a full process quote.

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