Chemical Etching Formula
Zr705 Zirconium Alloy
with HF(5%)+HNO₃(25%)
Formula Summary
The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.
Why HF(5%)+HNO₃(25%) for Zr705 Zirconium Alloy?
Hydrofluoric/nitric formulas are used for refractory and titanium-family metals such as Zr705 Zirconium Alloy because the fluoride ion is one of the few species that will break down their tenacious passive oxide. The nitric component oxidizes the freshly exposed metal so the fluoride can keep working. Handling demands are high, but for Zr705 Zirconium Alloy there is rarely a practical alternative.
Process Window & Bath Control
The process window for this HF(5%)+HNO₃(25%) formula centres on 36°C and as specified. Conveyor speed spans 0.12-0.77 m/min over the 0.05-0.3 mm thickness band; the typical operating point is 0.17 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.
Design Rules & Tolerances
Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-360 μm and the minimum line width ranges 100-300 μm across the 0.05-0.3 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 12-70 μm, and the etch factor is about 2.15. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.
• Minimum hole diameter range: 60-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 12-70 μm
• Typical etch factor (EF): 2.15
Yield & Production Economics
Expect a yield in the 91.8-92.4% range for Zr705 Zirconium Alloy with HF(5%)+HNO₃(25%), with 92.1% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.
Typical Applications
Zr705 Zirconium Alloy etched with this recipe typically ends up in nuclear-grade components and corrosion-resistant chemical hardware. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.
Process Equipment & Material Reference
This Zr705 Zirconium Alloy formula is part of the standard process library running on our plasma surface treatment machine. The same chemistry can be ported to any horizontal spray-etching line of comparable nozzle layout and bath-titration discipline.
Related to this formula, the Zirconium chemical etching guide page documents the full process envelope for the same alloy family, including pre-treatment chemistry and post-etch inspection criteria.
Production Use Cases for This Formula
Across the markets we serve, the HF(5%)+HNO₃(25%) formula on this page is most often deployed for stainless steel shower-head filter mesh, tea-infuser custom filter etching, and stainless steel mesh for aroma diffusers. These applications share thin-feature geometries that benefit from the predictable etch factor near 2.15 and the low single-side undercut documented above.
If your part falls into one of these classes — or a closely adjacent one — this formula is usually the right starting point. We confirm fit with a short sample run on the actual sheet stock before locking in mask artwork.
More Zirconium Formulas
Other formulas in the same material family.
Frequently Asked Questions
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- ASTM B912: Standard Specification for Passivation of Stainless Steels
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
Need a Quote for This Process?
WET Etched runs production wet chemical etching lines using the HF(5%)+HNO₃(25%) chemistry. Send us your part drawing and quantity for a full process quote.
