Metal & PCB Chemical Cleaning Machine
Production-grade chemical cleaning machine for pre-etch surface activation and post-etch finish preparation. Combines oil removal, mild…
View detailsPCB Super Roughening Machine
Conveyorized chemical roughening machine that creates a micro-textured copper surface for inner-layer adhesion in multilayer PCB stacks. Sequential micro-corrosion, medium-roughening, and acid pickling stages controllably etch crystalline pits into the copper foil — those pits become the mechanical anchor points that prepreg resin flows into during lamination. Surface roughness Ra is held to 0.3–0.6 μm with a tight production tolerance.
USD 3,900per linear meter
Ra 0.3–0.6 μmcontrolled roughness
Multilayer PCBinner-layer prep
13.9 mline length
Why This Equipment
- Two-stage roughening (micro-corrosion + medium-roughening) — pit nucleation and pit growth are decoupled, giving uniform pit density across the panel.
- Ra 0.3–0.6 μm controllable target — peel strength of inner-layer copper to prepreg jumps from < 0.5 N/mm to > 1.5 N/mm with proper roughening.
- Integrated acid pickle — removes the copper-salt residue from the roughening bath before rinse, so no salt nucleation sites are left.
- Four-stage post-pickle rinse + DI final — ion-free surface ready for prepreg lay-up.
- Tuned for prepreg lamination workflow — recipe matches the most common FR4 / high-Tg prepreg families.
Engineering Specifications
Where This Equipment Fits in the Production Line
Super roughening sits between PCB inner-layer etching and prepreg lamination. Without it, inner-layer copper does not bond reliably to the prepreg in multilayer stacks — delamination shows up as latent reliability failures in the field. Pairs with the OSP Machine for outer-layer copper finishing.
Request Quote & Layout Browse Process Library Search Parameter Database
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Related Recipes & Process Parameters
Every formula and parameter row below is a live page on this site with the full chemistry, conveyor speed, and tolerance window for the exact material-thickness-etchant combination. These are the references our process engineers cite from on production shifts.
C1100 T2 copper formula sheetFeCl₃ at 44 °C · 0.01 mm typical · through etch (double-sided)SPCC Cold-Rolled Steel formula sheetFeCl₃ at 46 °C · 0.01 mm typical · half etch (single-sided)C2680 Brass parameter record0.1 mm in FeCl₃ · conveyor 1.18 m/min · EF 2.8Inconel 625 parameter record0.05 mm in FeCl₃+HCl · conveyor 2.12 m/min · EF 2.5➜ All Etching Formulas (119+ alloys)Browse the full formula library by material, etchant, or depth.➜ Wet Etching Parameter Database (1,000+ records)Search the production parameter database by material grade and thickness.
Related Material References
Wet Chemical Etching TantalumEngineering reference for Tantalum — process, etchants, design rules, applications.Wet Chemical Etching BrassEngineering reference for Brass — process, etchants, design rules, applications.
Related Production Applications
Precision Medical Blade and Micro Needle Manufacturing with Chemical Etching TechnologyProduction case study and process flow for this application.Vegetable Shredder Fine Blade Disc EtchingProduction case study and process flow for this application.Animal and Plant Pattern EtchingProduction case study and process flow for this application.
Related Process Equipment
Frequently Asked Questions
Is this the same as the chemical cleaning machine?
No. Chemical cleaning removes contaminants from the surface; super roughening intentionally adds controlled texture to the surface. The chemistry is more aggressive (micro-etching the copper) and the bath sequence is different. Same panel might go through both — clean first, then roughen.
What roughness is required for typical FR4 lamination?
Ra 0.3–0.4 μm is the standard target for FR4 / 170 °C-Tg prepreg families. High-Tg or low-loss substrates (Megtron 6, Tachyon, etc.) require Ra 0.4–0.6 μm and a tighter uniformity spec — both inside this machine’s capability envelope.
What is the typical lead time from order to delivery?
Standard configurations: 8–12 weeks. Non-standard customizations: 12–16 weeks. Lead time includes mechanical build, electrical commissioning, bath chemistry validation on our pilot line, and packaged shipment.
What is the warranty?
Standard one-year warranty against manufacturing defects, plus lifetime maintenance support — spare parts are stocked and shipped from Shenzhen on order.
Frequently Asked Questions
What facility connections does the PCB Chemical Super Roughening Machine need?
Electrical, compressed-air, water, and exhaust requirements are confirmed in the installation drawing we issue before delivery, matched to your facility's available services.
Can the PCB Chemical Super Roughening Machine be customised for our process?
Yes. Conveyor width, tooling, control options, and the surrounding handling can be adapted to your panel size, throughput target, and facility constraints. Share your specification and we will propose a configuration.
What workpiece sizes does the PCB Chemical Super Roughening Machine handle?
Working size depends on the configured tooling and conveyor width. Share your largest and smallest part dimensions and we will confirm the achievable window.
What materials is the PCB Chemical Super Roughening Machine suitable for?
Material compatibility is confirmed against your substrate during process qualification. A small sample run is the fastest way to validate fit before committing to production.
Sources & References
- IPC-A-600: Acceptability of Printed Boards
- IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
