Drilling & Via Formation
WET-AS-6ZH 6 Spindles PCB Drilling and Routing Machine
WET-AS-6ZH 6 Spindles PCB Drilling and Routing Machine
View detailsPCB Jet Master Brushing & Polishing Machine
High-performance combined chemical + mechanical surface preparation line. Micro-corrosion etches the copper surface, an abrasive grinding head then mechanically finishes it, a sand-blasting cell produces an ultra-uniform matte, and three stages of pressurized + ultrasonic + high-pressure water washing rinse off the particulate. This is the surface preparation line for the most demanding PCB finish work: high-frequency boards, mil-spec PCB, and high-reliability flex.
USD 6,000per linear meter
Chem + grind + sandblasttriple action
Ultrasonicimmersion stage
58 kWtotal rated
Why This Equipment
- Three independent surface treatments in one line — chemical micro-etch, mechanical grind, abrasive sandblast — picked per recipe.
- Ultrasonic immersion cleaning — cavitation removes sub-micron particulate that even high-pressure spray misses.
- High-pressure final rinse — final polish step removes ultrasonic-loosened residue.
- Integrated sand-blast reclaim — abrasive media is captured, sieved, and returned, cutting media consumption 80%.
- Recipe-driven mode selection — same line runs from “light chemical only” to “full chem + grind + blast” per panel.
Engineering Specifications
Where This Equipment Fits in the Production Line
Jet Master is the heavy-duty alternative to the standard Plate Grinding Machine. It is specified ahead of fine-line lithography where conventional grinding cannot achieve the required surface uniformity, or ahead of OSP finishing for high-reliability applications where standard cleaning is not sufficient.
Request Quote & Layout Browse Process Library Search Parameter Database
Related Equipment in This Production Line
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Related Recipes & Process Parameters
Every formula and parameter row below is a live page on this site with the full chemistry, conveyor speed, and tolerance window for the exact material-thickness-etchant combination. These are the references our process engineers cite from on production shifts.
Ni201 pure nickel formula sheetFeCl₃+HCl at 50 °C · 0.15 mm typical · through etch (double-sided)TC6 Titanium Alloy formula sheetHF(5%)+HNO₃(30%) at 36 °C · 0.18 mm typical · through etch (double-sided)TC6 Titanium Alloy parameter record0.5 mm in HF(5%)+HNO₃(30%) · conveyor 0.12 m/min · EF 2.2Al6005 parameter record0.3 mm in FeCl₃+HCl · conveyor 0.23 m/min · EF 2.5➜ All Etching Formulas (119+ alloys)Browse the full formula library by material, etchant, or depth.➜ Wet Etching Parameter Database (1,000+ records)Search the production parameter database by material grade and thickness.
Related Material References
Wet Chemical Etching BrassEngineering reference for Brass — process, etchants, design rules, applications.Wet Chemical Etching RheniumEngineering reference for Rhenium — process, etchants, design rules, applications.
Related Production Applications
Universal Juicer Blade Plate EtchingProduction case study and process flow for this application.Custom thin film heating elements for flexible, high-performance heating padsProduction case study and process flow for this application.Bookmark EtchingProduction case study and process flow for this application.
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Frequently Asked Questions
What is included in commissioning?
On-site installation supervision by our engineering team, full mechanical and electrical commissioning, recipe loading and validation against three reference panel formats, operator training (typically 3–5 days), and one year of remote process support.
What is the warranty?
Standard one-year warranty against manufacturing defects, plus lifetime maintenance support — spare parts are stocked and shipped from Shenzhen on order.
When do I need this instead of the standard Plate Grinding Machine?
When line width drops below 50 μm, when boards are headed for high-frequency RF applications (where surface roughness affects insertion loss), or for high-reliability applications (mil/aero/medical) where the standard grinding line cannot meet the surface uniformity spec.
Is sand blasting on PCB damaging to the substrate?
No, when properly tuned. The abrasive media (typically alumina micro-spheres, 30–80 μm) and the impact pressure are sized to texture the copper surface only — the FR4 dielectric is masked by the resist film throughout. Damage occurs only when an out-of-spec recipe is run; the machine HMI enforces spec on the pressure and dwell.
Frequently Asked Questions
What workpiece sizes does the PCB Jet Master Brushing & Chemical Polishing Machine handle?
Working size depends on the configured tooling and conveyor width. Share your largest and smallest part dimensions and we will confirm the achievable window.
How is throughput determined for the PCB Jet Master Brushing & Chemical Polishing Machine?
Throughput depends on material thickness, feature density, and the inspection target. We size the machine against your real production mix rather than a single nominal number.
What facility connections does the PCB Jet Master Brushing & Chemical Polishing Machine need?
Electrical, compressed-air, water, and exhaust requirements are confirmed in the installation drawing we issue before delivery, matched to your facility's available services.
What does the PCB Jet Master Brushing & Chemical Polishing Machine do in the production line?
The PCB Jet Master Brushing & Chemical Polishing Machine performs a dedicated step in PCB fabrication. Correct placement relative to the upstream and downstream stages is what protects overall yield, cycle time, and cost per panel, so it is normally specified together with the cells immediately before and after it.
Sources & References
- IPC-A-600: Acceptability of Printed Boards
- IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
