Lamination & Multilayer
Hot and Cold Lamination Press (One Set Each)
Precision lamination & multilayer equipment specified to your panel size, throughput, and automation level.
View detailsDES Line — Develop / Etch / Strip Integrated Production Line
Flagship 35-meter end-to-end production line — the only equipment that takes a UV-exposed panel and returns a finished etched metal/PCB panel in a single conveyorized pass. Three etching stages, two film-removal stages, and a full pickling-and-finish cascade are integrated under one PLC. At 740 × 740 mm panel capacity and 0.075 mm minimum thickness, this is the production platform for high-density flexible PCB, precision lead frames, and chemically-etched battery grids.
USD 4,400per linear meter
35.5 mtotal line length
183 kWrated power
0.075 mmminimum thickness
Why This Equipment
- UV-exposed panel in, finished panel out — eliminates inter-station handling, the single largest source of panel-yield loss in PCB and precision etching.
- Three sequential etching stages — graduated chemistry / temperature lets EF stay above 3.0 even on 0.075 mm flexible stock.
- Two-stage film removal with integrated acid pickle — finished panel ready for plating, ENIG, or OSP without additional cleaning.
- 10+ independent bath cells — each titrated and temperature-controlled separately; no chemistry cross-contamination.
- Two in-line inspection stations — mid-line and post-strip — operators can pull panels before downstream stages commit.
Engineering Specifications
Where This Equipment Fits in the Production Line
The DES line replaces an entire wet processing sequence — Developing Machine + Spray Etching Machine + Photoresist Stripping Machine + Chemical Cleaning Machine — with one integrated platform. Pairs upstream with UV exposure and downstream with OSP or Brown Oxidation for surface finish.
When to Specify a DES Line vs. Standalone Machines
The DES line is the right answer when (a) your production volume justifies a dedicated platform that runs the same panel format day in / day out, (b) labor cost makes between-station handling expensive, and (c) the application is sensitive to contamination — flexible PCB, fine-pitch lead frames, battery current collectors. It is the wrong answer when your product mix is highly varied, when you need to share the etching cell with manual-load short runs, or when floor space is tight.
- Best fit: dedicated PCB / lead-frame / battery-grid production above 5,000 panels/month.
- Marginal fit: shops that run 3+ different panel formats per week — standalone machines give more flexibility.
- Wrong fit: prototype shops, short-run / mixed-material work — see the bench-top knife-mold machine instead.
Request Quote & Layout Browse Process Library Search Parameter Database
Related Equipment in This Production Line
Wet Chemical Etching Machine (overview)General wet chemical etching production line — main equipment overview.Precision Acid Cleaning Machine5-stage cleaning line: water wash, micro-etch, ultrasonic, pickle, anti-oxidation.PCB Tin Stripping MachineConveyorized tin and tin-lead stripping machine for post-etch removal of the tin protective layer used as a temporary etch mask in…Metal & PCB Photoresist Developing MachineConveyorized photoresist developing machine for both dry-film and liquid-resist lithography. Two sequential development sprays rem…
Related Recipes & Process Parameters
Every formula and parameter row below is a live page on this site with the full chemistry, conveyor speed, and tolerance window for the exact material-thickness-etchant combination. These are the references our process engineers cite from on production shifts.
SUS304 formula sheetFeCl₃+HCl at 47 °C · 0.04 mm typical · through etch (double-sided)Al5005 formula sheetFeCl₃+HCl at 40 °C · 0.25 mm typical · through etch (double-sided)Ni201 Pure Nickel parameter record0.3 mm in FeCl₃+HCl · conveyor 0.19 m/min · EF 2.8C5101 Phosphor Bronze parameter record0.5 mm in FeCl₃ · conveyor 0.12 m/min · EF 2.7➜ All Etching Formulas (119+ alloys)Browse the full formula library by material, etchant, or depth.➜ Wet Etching Parameter Database (1,000+ records)Search the production parameter database by material grade and thickness.
Related Material References
Wet Chemical Etching RheniumEngineering reference for Rhenium — process, etchants, design rules, applications.Wet Chemical Etching TantalumEngineering reference for Tantalum — process, etchants, design rules, applications.
Related Production Applications
Copper Craftsmanship EtchingProduction case study and process flow for this application.Precision Medical Blade and Micro Needle Manufacturing with Chemical Etching TechnologyProduction case study and process flow for this application.Universal Juicer Blade Plate EtchingProduction case study and process flow for this application.
Related Process Equipment
Frequently Asked Questions
What is the total floor area required?
35.5 m line length × 2.75 m width plus 1.5 m clearance each side and 2 m at each end for operator access — call it 38 m × 5.75 m, roughly 220 m² for the line itself. Add chemistry storage and panel staging and the cell typically wants 350–450 m² total.
What is the typical lead time from order to delivery?
Standard configurations: 8–12 weeks. Non-standard customizations: 12–16 weeks. Lead time includes mechanical build, electrical commissioning, bath chemistry validation on our pilot line, and packaged shipment.
Are CE / UL / SEMI compliance packages available?
Yes. CE, UL listing, and SEMI S2 / S8 compliance packages are engineering options. Specify at order time so wetted parts, electrical, and safety circuits are sized accordingly. Compliance documentation accompanies the equipment at delivery.
Is the machine customized to my production line?
Yes. Every system is built around your panel size, throughput target, available utilities, and downstream process integration. Standard dimensions in the spec table are the most-ordered configurations, but length, width, and bath sequence are all configurable.
Frequently Asked Questions
What level of automation does the Chemical DES Line (Develop-Etch-Strip) offer?
Operation is recipe-driven through an operator interface, with process values logged so that results stay repeatable across shifts and operators.
Can the Chemical DES Line (Develop-Etch-Strip) be customised for our process?
Yes. Conveyor width, tooling, control options, and the surrounding handling can be adapted to your panel size, throughput target, and facility constraints. Share your specification and we will propose a configuration.
What does the Chemical DES Line (Develop-Etch-Strip) do in the production line?
The Chemical DES Line (Develop-Etch-Strip) is configured for a specific stage of the wet-processing or precision-machining sequence. It is usually integrated with the handling and rinse stages around it so that throughput and surface quality stay consistent batch to batch.
What materials is the Chemical DES Line (Develop-Etch-Strip) suitable for?
Material compatibility is confirmed against your substrate during process qualification. A small sample run is the fastest way to validate fit before committing to production.
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- ASTM B912: Standard Specification for Passivation of Stainless Steels
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
