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View detailsPCB Tin Stripping Machine
Conveyorized tin and tin-lead stripping machine for post-etch removal of the tin protective layer used as a temporary etch mask in pattern-plating PCB workflows. A controlled-temperature stripping bath rapidly removes electroplated tin (or tin-lead) from the underlying copper without attacking the copper itself. Compact 6.4-meter footprint and only 15 kW rated power — the lowest-utility-cost wet processing cell in this product line.
USD 3,900per linear meter
6.4 mcompact footprint
15 kWlowest power draw
Cu-selectiveno copper attack
Why This Equipment
- Copper-selective chemistry — tin and tin-lead strip cleanly without measurable copper loss.
- Three-stage overflow rinse — nitric residue washed below detection limit before drying.
- Compact 6.4 m footprint — fits in any PCB shop without facility upgrade.
- Lowest utility cost in the product line — 15 kW total, no high-power heating required.
- Drop-in for SES line — exact same wetted parts and chemistry as the tin-strip stages inside the SES Line, so spares are interchangeable.
Engineering Specifications
Where This Equipment Fits in the Production Line
Tin stripping comes AFTER pattern-plating + etching, when the tin layer that protected the circuit traces during etching needs to come off. Often paired with the Photoresist Stripping Machine in the same shop. Replaced entirely by the integrated SES Line in high-volume facilities.
Request Quote & Layout Browse Process Library Search Parameter Database
Related Equipment in This Production Line
Wet Chemical Etching Machine (overview)General wet chemical etching production line — main equipment overview.Precision Acid Cleaning Machine5-stage cleaning line: water wash, micro-etch, ultrasonic, pickle, anti-oxidation.Metal & PCB Photoresist Developing MachineConveyorized photoresist developing machine for both dry-film and liquid-resist lithography. Two sequential development sprays rem…SES Line (Strip-Etch-Strip)Fully integrated 32-meter production line that performs photoresist stripping, compensation etching, and tin stripping in a single…
Related Recipes & Process Parameters
Every formula and parameter row below is a live page on this site with the full chemistry, conveyor speed, and tolerance window for the exact material-thickness-etchant combination. These are the references our process engineers cite from on production shifts.
QAl9-2 Aluminum Bronze formula sheetFeCl₃ at 48 °C · 0.15 mm typical · through etch (double-sided)SUS410 formula sheetFeCl₃+HCl at 47 °C · 0.18 mm typical · through etch (double-sided)Al2024 parameter record0.25 mm in FeCl₃+HCl · conveyor 0.3 m/min · EF 2.5C17200 Beryllium Copper parameter record0.05 mm in FeCl₃+HCl · conveyor 2.77 m/min · EF 2.8➜ All Etching Formulas (119+ alloys)Browse the full formula library by material, etchant, or depth.➜ Wet Etching Parameter Database (1,000+ records)Search the production parameter database by material grade and thickness.
Related Material References
Wet Chemical Etching TantalumEngineering reference for Tantalum — process, etchants, design rules, applications.Wet Chemical Etching RheniumEngineering reference for Rhenium — process, etchants, design rules, applications.
Related Production Applications
Animal and Plant Pattern EtchingProduction case study and process flow for this application.Bookmark EtchingProduction case study and process flow for this application.High-precision Etching Stamping Lead FramesProduction case study and process flow for this application.
Related Process Equipment
Frequently Asked Questions
Is the machine customized to my production line?
Yes. Every system is built around your panel size, throughput target, available utilities, and downstream process integration. Standard dimensions in the spec table are the most-ordered configurations, but length, width, and bath sequence are all configurable.
Can this also strip tin-lead solder finish?
Yes. The same stripping chemistry handles both Sn and Sn-Pb. For ROHS-compliant lead-free production this is no longer common, but legacy / aerospace applications still ship with Sn-Pb. The bath is also compatible with Sn-Bi and Sn-Ag-Cu (SAC) finishes.
What is included in commissioning?
On-site installation supervision by our engineering team, full mechanical and electrical commissioning, recipe loading and validation against three reference panel formats, operator training (typically 3–5 days), and one year of remote process support.
Are CE / UL / SEMI compliance packages available?
Yes. CE, UL listing, and SEMI S2 / S8 compliance packages are engineering options. Specify at order time so wetted parts, electrical, and safety circuits are sized accordingly. Compliance documentation accompanies the equipment at delivery.
Frequently Asked Questions
What does the PCB Tin Chemical Stripping Machine do in the production line?
The PCB Tin Chemical Stripping Machine performs a dedicated step in PCB fabrication. Correct placement relative to the upstream and downstream stages is what protects overall yield, cycle time, and cost per panel, so it is normally specified together with the cells immediately before and after it.
What materials is the PCB Tin Chemical Stripping Machine suitable for?
Material compatibility is confirmed against your substrate during process qualification. A small sample run is the fastest way to validate fit before committing to production.
What workpiece sizes does the PCB Tin Chemical Stripping Machine handle?
Working size depends on the configured tooling and conveyor width. Share your largest and smallest part dimensions and we will confirm the achievable window.
Can the PCB Tin Chemical Stripping Machine be customised for our process?
Yes. Conveyor width, tooling, control options, and the surrounding handling can be adapted to your panel size, throughput target, and facility constraints. Share your specification and we will propose a configuration.
Sources & References
- IPC-A-600: Acceptability of Printed Boards
- IPC-6012: Qualification and Performance Specification for Rigid Printed Boards
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
