Pure Nickel FeCl₃+HCl

Chemical Etching Formula
Ni201 pure nickel with FeCl₃+HCl

This reference describes how Ni201 pure nickel responds to the FeCl₃+HCl etching formula. At a bath temperature of 50°C and concentration of 44 °Bé, the recipe holds an etch factor of about 2.79 and a typical production yield of 96.7%. It is intended as engineering reference data for design, sourcing, and process planning.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
44 °Bé Concentration
1.410 Specific Gravity
50 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.3 mm Thickness Range
0.15 mm Typical Thickness
0.19-2.83 m/min Conveyor Speed Range
0.68 m/min Typical Speed
60-360 μm Min Hole Ø Range
100-300 μm Min Line Width Range
9-54 μm Undercut Range
2.79 Etch Factor (EF)
96.7% Typical Yield (96.2-96.9%)

Why FeCl₃+HCl for Ni201 pure nickel?

On Ni201 pure nickel, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every Ni201 pure nickel etch line runs a variant of this formula.

Process Window & Bath Control

Hold the bath at 50°C with concentration 44 °Bé (specific gravity 1.410). Across the 0.05-0.3 mm thickness range, conveyor speed runs from 0.19-2.83 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.68 m/min for 0.15 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-360 μm and the minimum line width ranges 100-300 μm across the 0.05-0.3 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 9-54 μm, and the etch factor is about 2.79. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 60-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 9-54 μm
• Typical etch factor (EF): 2.79

Yield & Production Economics

Expect a yield in the 96.2-96.9% range for Ni201 pure nickel with FeCl₃+HCl, with 96.7% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Parts produced with the FeCl₃+HCl formula on Ni201 pure nickel are common in battery tab interconnects, fuel-cell components, and corrosion-resistant masks. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

More Pure Nickel Formulas

Other formulas in the same material family.

Monel 400 FeCl₃+HCl Through etch (double-sided) Monel K500 FeCl₃+HCl Through etch (double-sided) Ni200 pure nickel FeCl₃+HCl Through etch (double-sided) Ni200 pure nickel FeCl₃+HCl Half etch (single-sided)

Frequently Asked Questions

Run the bath at 50°C. Holding much above 55°C can degrade photoresist adhesion and erode feature edges; running below 45°C slows the etch and forces a conveyor-speed reduction. Production lines hold 50°C within ±1.5°C using redundant PID control.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.

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