Pure Nickel FeCl₃+HCl

Chemical Etching Formula
Monel K500 with FeCl₃+HCl

For engineers selecting an etching chemistry for Monel K500, the FeCl₃+HCl formula shown here defines the bath composition, temperature window, and achievable feature sizes across a 0.1-0.3 mm thickness band. Typical mass-production yield for this recipe is 95.2%, with a typical conveyor speed of 0.28 m/min at 52°C.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
46 °Bé Concentration
1.430 Specific Gravity
52 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.1-0.3 mm Thickness Range
0.20 mm Typical Thickness
0.15-0.8 m/min Conveyor Speed Range
0.28 m/min Typical Speed
120-360 μm Min Hole Ø Range
100-300 μm Min Line Width Range
19-58 μm Undercut Range
2.58 Etch Factor (EF)
95.2% Typical Yield (94.9-95.5%)

Why FeCl₃+HCl for Monel K500?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like Monel K500. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on Monel K500 is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Bath control for Monel K500 in FeCl₃+HCl: temperature 52°C, concentration 46 °Bé, specific gravity 1.430. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.15-0.8 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 120-360 μm, line width 100-300 μm, single-side undercut 19-58 μm — all as a function of thickness across 0.1-0.3 mm. The higher the etch factor (this formula holds about 2.58), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Design Rule Summary
• Minimum hole diameter range: 120-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 19-58 μm
• Typical etch factor (EF): 2.58

Yield & Production Economics

Typical mass-production yield for Monel K500 in the FeCl₃+HCl system is 95.2%, within an observed range of 94.9-95.5%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.

Typical Applications

Parts produced with the FeCl₃+HCl formula on Monel K500 are common in battery tab interconnects, fuel-cell components, and corrosion-resistant masks. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

More Pure Nickel Formulas

Other formulas in the same material family.

Monel 400 FeCl₃+HCl Through etch (double-sided) Ni200 pure nickel FeCl₃+HCl Through etch (double-sided) Ni200 pure nickel FeCl₃+HCl Half etch (single-sided) Ni201 pure nickel FeCl₃+HCl Through etch (double-sided)

Frequently Asked Questions

Typical mass-production yield is 95.2%, within an observed range of 94.9-95.5%. The leading yield-loss modes are photoresist pinhole defects and rinse contamination, so the fastest route to a higher number is tighter incoming-sheet and coating control rather than changes to the etch bath.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.

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