Pure Nickel FeCl₃+HCl

Chemical Etching Formula
Ni200 pure nickel with FeCl₃+HCl

Working with Ni200 pure nickel on a chemical etch line begins with the right formula. The FeCl₃+HCl system documented below produces half etch (single-sided) across 0.01 mm sheet, with a minimum hole-diameter range of 8 μm and a minimum line-width range of 100 μm. The numbers scale with thickness — thinner stock yields finer features.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
44 °Bé Concentration
1.410 Specific Gravity
50 °C Bath Temperature
Half etch (single-sided) Etch Depth Type
0.01 mm Thickness Range
0.01 mm Typical Thickness
68.04 m/min Conveyor Speed Range
68.04 m/min Typical Speed
8 μm Min Hole Ø Range
100 μm Min Line Width Range
1 μm Undercut Range
2.78 Etch Factor (EF)
97.0% Typical Yield (97%)

Why FeCl₃+HCl for Ni200 pure nickel?

On Ni200 pure nickel, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every Ni200 pure nickel etch line runs a variant of this formula.

Process Window & Bath Control

Hold the bath at 50°C with concentration 44 °Bé (specific gravity 1.410). Across the 0.01 mm thickness range, conveyor speed runs from 68.04 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 68.04 m/min for 0.01 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 8 μm, line width 100 μm, single-side undercut 1 μm — all as a function of thickness across 0.01 mm. The higher the etch factor (this formula holds about 2.78), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Design Rule Summary
• Minimum hole diameter range: 8 μm
• Minimum line width range: 100 μm
• Single-side undercut range: 1 μm
• Typical etch factor (EF): 2.78

Yield & Production Economics

Typical mass-production yield for Ni200 pure nickel in the FeCl₃+HCl system is 97.0%, within an observed range of 97%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.

Typical Applications

Typical applications for Ni200 pure nickel processed with FeCl₃+HCl include battery tab interconnects, fuel-cell components, and corrosion-resistant masks. The formula's tolerance band and yield make it well suited to medium-to-high-volume precision flat parts.

More Pure Nickel Formulas

Other formulas in the same material family.

Monel 400 FeCl₃+HCl Through etch (double-sided) Monel K500 FeCl₃+HCl Through etch (double-sided) Ni200 pure nickel FeCl₃+HCl Through etch (double-sided) Ni201 pure nickel FeCl₃+HCl Through etch (double-sided)

Frequently Asked Questions

Typical mass-production yield is 97.0%, within an observed range of 97%. The leading yield-loss modes are photoresist pinhole defects and rinse contamination, so the fastest route to a higher number is tighter incoming-sheet and coating control rather than changes to the etch bath.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.

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