Pure Nickel FeCl₃+HCl

Chemical Etching Formula
Ni200 pure nickel with FeCl₃+HCl

For engineers selecting an etching chemistry for Ni200 pure nickel, the FeCl₃+HCl formula shown here defines the bath composition, temperature window, and achievable feature sizes across a 0.01-0.5 mm thickness band. Typical mass-production yield for this recipe is 97.8%, with a typical conveyor speed of 8.00 m/min at 50°C.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
44 °Bé Concentration
1.410 Specific Gravity
50 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.01-0.5 mm Thickness Range
0.03 mm Typical Thickness
0.12-68.04 m/min Conveyor Speed Range
8.00 m/min Typical Speed
8-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
1-90 μm Undercut Range
2.80 Etch Factor (EF)
97.8% Typical Yield (95.5-98.5%)

Why FeCl₃+HCl for Ni200 pure nickel?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like Ni200 pure nickel. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on Ni200 pure nickel is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Hold the bath at 50°C with concentration 44 °Bé (specific gravity 1.410). Across the 0.01-0.5 mm thickness range, conveyor speed runs from 0.12-68.04 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 8.00 m/min for 0.03 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 8-600 μm, line width 100-500 μm, single-side undercut 1-90 μm — all as a function of thickness across 0.01-0.5 mm. The higher the etch factor (this formula holds about 2.80), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Design Rule Summary
• Minimum hole diameter range: 8-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 1-90 μm
• Typical etch factor (EF): 2.80

Yield & Production Economics

Expect a yield in the 95.5-98.5% range for Ni200 pure nickel with FeCl₃+HCl, with 97.8% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Parts produced with the FeCl₃+HCl formula on Ni200 pure nickel are common in battery tab interconnects, fuel-cell components, and corrosion-resistant masks. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

More Pure Nickel Formulas

Other formulas in the same material family.

Monel 400 FeCl₃+HCl Through etch (double-sided) Monel K500 FeCl₃+HCl Through etch (double-sided) Ni200 pure nickel FeCl₃+HCl Half etch (single-sided) Ni201 pure nickel FeCl₃+HCl Through etch (double-sided)

Frequently Asked Questions

Both standard dry-film photoresists (typically 1.5–2.0 mil) and aqueous-developable liquid resists are compatible with FeCl₃+HCl at 50°C. Resist choice is driven by resolution: features near the fine end of the 100-500 μm line-width range usually call for liquid resist, while larger features can use lower-cost dry film.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.

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