Chemical Etching Formula
C1020 OF Copper with FeCl₃

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

Why FeCl₃ for C1020 OF Copper?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like C1020 OF Copper. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on C1020 OF Copper is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Hold the bath at 46°C with concentration 36 °Bé (specific gravity 1.340). Across the 0.05-0.3 mm thickness range, conveyor speed runs from 0.26-3.22 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.84 m/min for 0.15 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 60-360 μm, line width 100-300 μm, single-side undercut 9-53 μm — all as a function of thickness across 0.05-0.3 mm. The higher the etch factor (this formula holds about 2.83), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Yield & Production Economics

Expect a yield in the 97.8-98.4% range for C1020 OF Copper with FeCl₃, with 98.1% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

C1020 OF Copper etched with this recipe typically ends up in lead frames, busbars, flexible heater elements, RF gaskets, and precision electrical contacts. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

Process Equipment & Material Reference

Process equipment for the C1020 OF Copper / FeCl₃ combination is built around our plasma surface treatment machine platform — closed-loop temperature control, redundant pump headers, and metering for bath replenishment all directly affect the etch factor and yield numbers cited on this page.

If you need a wider view of copper beyond this single recipe, our Copper chemical etching guide covers grade selection, photoresist compatibility, and typical industries that consume this metal in etched form.

Production Use Cases for This Formula

Across the markets we serve, the FeCl₃ formula on this page is most often deployed for stainless steel shower-head filter mesh, cold-press juicer filtration mesh, and ultrasonic mesh for robotic vacuum cleaners. These applications share thin-feature geometries that benefit from the predictable etch factor near 2.83 and the low single-side undercut documented above.

Designs that sit slightly outside this thickness or feature-size envelope are usually addressable by a sister formula in the same etchant family. The bath chemistry stays the same; the tuning shifts to conveyor speed and resist choice.

Other Metals Etched with FeCl₃

The FeCl₃ chemistry is also documented for these alloys.

More Copper & Brass Formulas

Other formulas in the same material family.

Frequently Asked Questions