Chemical Etching Formula
C1100 T2 copper with FeCl₃

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

Why FeCl₃ for C1100 T2 copper?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like C1100 T2 copper. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on C1100 T2 copper is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

The process window for this FeCl₃ formula centres on 44°C and 36 °Bé. Conveyor speed spans 0.2-2.51 m/min over the 0.05-0.3 mm thickness band; the typical operating point is 0.66 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-360 μm and the minimum line width ranges 100-300 μm across the 0.05-0.3 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 9-53 μm, and the etch factor is about 2.85. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Yield & Production Economics

This formula delivers a typical yield of 98.5% (range 98.2-98.7%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.

Typical Applications

Typical applications for C1100 T2 copper processed with FeCl₃ include lead frames, busbars, flexible heater elements, RF gaskets, and precision electrical contacts. The formula's tolerance band and yield make it well suited to medium-to-high-volume precision flat parts.

Process Equipment & Material Reference

Process equipment for the C1100 T2 copper / FeCl₃ combination is built around our wet chemical etching machine platform — closed-loop temperature control, redundant pump headers, and metering for bath replenishment all directly affect the etch factor and yield numbers cited on this page.

If you need a wider view of copper beyond this single recipe, our Copper chemical etching guide covers grade selection, photoresist compatibility, and typical industries that consume this metal in etched form.

Production Use Cases for This Formula

Across the markets we serve, the FeCl₃ formula on this page is most often deployed for high-precision etched lead frames, electronic thin-film component etching, and mobile-phone earpiece mesh. These applications share thin-feature geometries that benefit from the predictable etch factor near 2.85 and the low single-side undercut documented above.

If your part falls into one of these classes — or a closely adjacent one — this formula is usually the right starting point. We confirm fit with a short sample run on the actual sheet stock before locking in mask artwork.

Other Metals Etched with FeCl₃

The FeCl₃ chemistry is also documented for these alloys.

More Copper & Brass Formulas

Other formulas in the same material family.

Frequently Asked Questions