Copper & Brass FeCl₃

Chemical Etching Formula
C2600 brass with FeCl₃

This reference describes how C2600 brass responds to the FeCl₃ etching formula. At a bath temperature of 44°C and concentration of 38 °Bé, the recipe holds an etch factor of about 2.80 and a typical production yield of 97.8%. It is intended as engineering reference data for design, sourcing, and process planning.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃ Etchant System
38 °Bé Concentration
1.360 Specific Gravity
44 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.5 mm Thickness Range
0.18 mm Typical Thickness
0.12-3.11 m/min Conveyor Speed Range
0.56 m/min Typical Speed
60-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
9-89 μm Undercut Range
2.80 Etch Factor (EF)
97.8% Typical Yield (97-98.1%)

Why FeCl₃ for C2600 brass?

On C2600 brass, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every C2600 brass etch line runs a variant of this formula.

Process Window & Bath Control

Bath control for C2600 brass in FeCl₃: temperature 44°C, concentration 38 °Bé, specific gravity 1.360. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-3.11 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-600 μm and the minimum line width ranges 100-500 μm across the 0.05-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 9-89 μm, and the etch factor is about 2.80. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 60-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 9-89 μm
• Typical etch factor (EF): 2.80

Yield & Production Economics

Expect a yield in the 97-98.1% range for C2600 brass with FeCl₃, with 97.8% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

C2600 brass etched with this recipe typically ends up in lead frames, busbars, flexible heater elements, RF gaskets, and precision electrical contacts. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Copper & Brass Formulas

Other formulas in the same material family.

C1020 OF Copper FeCl₃ Through etch (double-sided) C1100 T2 copper FeCl₃ Through etch (double-sided) C1100 T2 copper FeCl₃ Through etch (double-sided) C1100 T2 copper FeCl₃ Through etch (double-sided) C1100 T2 copper FeCl₃ Through etch (double-sided) C1100 T2 copper FeCl₃ Half etch (single-sided)

Frequently Asked Questions

Single-side undercut ranges 9-89 μm depending on thickness and dwell time. When sizing the photomask for a finished feature on C2600 brass, subtract twice the expected undercut from the target width so the etched dimension lands on specification.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃ chemistry. Send us your part drawing and quantity for a full process quote.

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