Chemical Etching Formula
C1100 T2 copper
with FeCl₃
Formula Summary
The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.
Why FeCl₃ for C1100 T2 copper?
Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like C1100 T2 copper. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on C1100 T2 copper is anisotropic etching with predictable undercut and an easily regenerated spent bath.
Process Window & Bath Control
The process window for this FeCl₃ formula centres on 46°C and 36 °Bé. Conveyor speed spans 0.13-85.05 m/min over the 0.01-0.5 mm thickness band; the typical operating point is 1.25 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.
Design Rules & Tolerances
When laying out artwork for C1100 T2 copper at through etch (double-sided), plan for a minimum hole diameter in the 8-600 μm range and a minimum line width in the 100-500 μm range, depending on the chosen sheet thickness within 0.01-0.5 mm. The etch factor of ~2.82 and undercut range of 1-89 μm determine how much the mask must be biased to land the finished dimension on target.
• Minimum hole diameter range: 8-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 1-89 μm
• Typical etch factor (EF): 2.82
Yield & Production Economics
Expect a yield in the 97.1-98.5% range for C1100 T2 copper with FeCl₃, with 98.1% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.
Typical Applications
Typical applications for C1100 T2 copper processed with FeCl₃ include lead frames, busbars, flexible heater elements, RF gaskets, and precision electrical contacts. The formula's tolerance band and yield make it well suited to medium-to-high-volume precision flat parts.
Process Equipment & Material Reference
Process equipment for the C1100 T2 copper / FeCl₃ combination is built around our wet chemical etching machine platform — closed-loop temperature control, redundant pump headers, and metering for bath replenishment all directly affect the etch factor and yield numbers cited on this page.
Related to this formula, the Copper chemical etching guide page documents the full process envelope for the same alloy family, including pre-treatment chemistry and post-etch inspection criteria.
Production Use Cases for This Formula
Production examples for the C1100 T2 copper / FeCl₃ recipe span juicer filtration mesh etching, high-speed air-intake mesh for hair dryers, and soy-milk-maker filtration mesh. In every case, the etch factor and undercut figures on this page are the dominant tolerance drivers — bath maintenance discipline matters more than equipment headline rating.
Adjacent applications usually transfer onto this same formula with no chemistry change, sometimes only a conveyor speed tweak. Drop a drawing and a target volume and we will return a process card built off the parameters on this page.
More Copper & Brass Formulas
Other formulas in the same material family.
Frequently Asked Questions
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- ASTM B912: Standard Specification for Passivation of Stainless Steels
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
Need a Quote for This Process?
WET Etched runs production wet chemical etching lines using the FeCl₃ chemistry. Send us your part drawing and quantity for a full process quote.