Chemical Etching Formula
C2680 brass with FeCl₃

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

Why FeCl₃ for C2680 brass?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like C2680 brass. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on C2680 brass is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Hold the bath at 44°C with concentration 38 °Bé (specific gravity 1.360). Across the 0.05-0.5 mm thickness range, conveyor speed runs from 0.12-3.11 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.56 m/min for 0.18 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

When laying out artwork for C2680 brass at through etch (double-sided), plan for a minimum hole diameter in the 60-600 μm range and a minimum line width in the 100-500 μm range, depending on the chosen sheet thickness within 0.05-0.5 mm. The etch factor of ~2.79 and undercut range of 9-90 μm determine how much the mask must be biased to land the finished dimension on target.

Yield & Production Economics

This formula delivers a typical yield of 97.8% (range 97-98.1%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.

Typical Applications

Parts produced with the FeCl₃ formula on C2680 brass are common in lead frames, busbars, flexible heater elements, RF gaskets, and precision electrical contacts. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

Process Equipment & Material Reference

On the shop floor, this C2680 brass + FeCl₃ recipe is implemented on a wet chemical etching machine. The 44°C bath setpoint and 0.12-3.11 m/min conveyor range correspond to verified production envelopes on that equipment for through etch (double-sided).

The Brass chemical etching guide reference goes one level above the recipe shown here, surveying the full thickness range, depth options, and common subgrades we run for brass.

Production Use Cases for This Formula

Production examples for the C2680 brass / FeCl₃ recipe span cold-press juicer filtration mesh, tea-infuser custom filter etching, and stainless steel shower-head filter mesh. In every case, the etch factor and undercut figures on this page are the dominant tolerance drivers — bath maintenance discipline matters more than equipment headline rating.

Designs that sit slightly outside this thickness or feature-size envelope are usually addressable by a sister formula in the same etchant family. The bath chemistry stays the same; the tuning shifts to conveyor speed and resist choice.

Other Metals Etched with FeCl₃

The FeCl₃ chemistry is also documented for these alloys.

More Copper & Brass Formulas

Other formulas in the same material family.

Frequently Asked Questions