Chemical Etching Formula
C1100 T2 copper with FeCl₃

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

Why FeCl₃ for C1100 T2 copper?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like C1100 T2 copper. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on C1100 T2 copper is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Hold the bath at 45°C with concentration 36 °Bé (specific gravity 1.340). Across the 0.02-0.08 mm thickness range, conveyor speed runs from 1.71-11.9 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 4.51 m/min for 0.04 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 24-96 μm, line width 100 μm, single-side undercut 46126 μm — all as a function of thickness across 0.02-0.08 mm. The higher the etch factor (this formula holds about 2.83), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Yield & Production Economics

Expect a yield in the 98.4-98.7% range for C1100 T2 copper with FeCl₃, with 98.6% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Parts produced with the FeCl₃ formula on C1100 T2 copper are common in lead frames, busbars, flexible heater elements, RF gaskets, and precision electrical contacts. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.

Process Equipment & Material Reference

Process equipment for the C1100 T2 copper / FeCl₃ combination is built around our wet chemical etching machine platform — closed-loop temperature control, redundant pump headers, and metering for bath replenishment all directly affect the etch factor and yield numbers cited on this page.

If you need a wider view of copper beyond this single recipe, our Copper chemical etching guide covers grade selection, photoresist compatibility, and typical industries that consume this metal in etched form.

Production Use Cases for This Formula

Across the markets we serve, the FeCl₃ formula on this page is most often deployed for stainless steel shower-head filter mesh, high-speed air-intake mesh for hair dryers, and high-precision etched lead frames. These applications share thin-feature geometries that benefit from the predictable etch factor near 2.83 and the low single-side undercut documented above.

If your part falls into one of these classes — or a closely adjacent one — this formula is usually the right starting point. We confirm fit with a short sample run on the actual sheet stock before locking in mask artwork.

Other Metals Etched with FeCl₃

The FeCl₃ chemistry is also documented for these alloys.

More Copper & Brass Formulas

Other formulas in the same material family.

Frequently Asked Questions