Stainless Steel FeCl₃+HCl

Chemical Etching Formula
SUS304 with FeCl₃+HCl

The FeCl₃+HCl chemistry is a proven formula for SUS304. This reference sheet lists the concentration (44 °Bé), specific gravity (1.410), bath temperature (46°C), and the full range of conveyor speeds and feature tolerances that result. Use it to size your process before committing to a production trial.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
44 °Bé Concentration
1.410 Specific Gravity
46 °C Bath Temperature
Half etch (single-sided) Etch Depth Type
0.01-0.5 mm Thickness Range
0.15 mm Typical Thickness
0.12-68.04 m/min Conveyor Speed Range
0.50 m/min Typical Speed
8-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
1-89 μm Undercut Range
2.82 Etch Factor (EF)
97.8% Typical Yield (97.2-98.2%)

Why FeCl₃+HCl for SUS304?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like SUS304. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on SUS304 is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Hold the bath at 46°C with concentration 44 °Bé (specific gravity 1.410). Across the 0.01-0.5 mm thickness range, conveyor speed runs from 0.12-68.04 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.50 m/min for 0.15 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 8-600 μm and the minimum line width ranges 100-500 μm across the 0.01-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 1-89 μm, and the etch factor is about 2.82. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 8-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 1-89 μm
• Typical etch factor (EF): 2.82

Yield & Production Economics

Typical mass-production yield for SUS304 in the FeCl₃+HCl system is 97.8%, within an observed range of 97.2-98.2%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.

Typical Applications

SUS304 etched with this recipe typically ends up in precision shims, encoder discs, RF/EMI shields, surgical and dental components, fuel-cell bipolar plates, and fine filter meshes. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Stainless Steel Formulas

Other formulas in the same material family.

Frequently Asked Questions

Target specific gravity is 1.410 for this formula. Check it each shift with a calibrated hydrometer. A falling SG indicates the bath is becoming depleted; a rising SG usually points to evaporative water loss that should be corrected with controlled water addition.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.