Stainless Steel FeCl₃+HCl

Chemical Etching Formula
SUS310S with FeCl₃+HCl

For engineers selecting an etching chemistry for SUS310S, the FeCl₃+HCl formula shown here defines the bath composition, temperature window, and achievable feature sizes across a 0.1-0.5 mm thickness band. Typical mass-production yield for this recipe is 96.4%, with a typical conveyor speed of 0.34 m/min at 54°C.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
46 °Bé Concentration
1.430 Specific Gravity
54 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.1-0.5 mm Thickness Range
0.20 mm Typical Thickness
0.12-0.95 m/min Conveyor Speed Range
0.34 m/min Typical Speed
120-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
19-97 μm Undercut Range
2.58 Etch Factor (EF)
96.4% Typical Yield (95.5-96.7%)

Why FeCl₃+HCl for SUS310S?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like SUS310S. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on SUS310S is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Bath control for SUS310S in FeCl₃+HCl: temperature 54°C, concentration 46 °Bé, specific gravity 1.430. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-0.95 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.

Design Rules & Tolerances

When laying out artwork for SUS310S at through etch (double-sided), plan for a minimum hole diameter in the 120-600 μm range and a minimum line width in the 100-500 μm range, depending on the chosen sheet thickness within 0.1-0.5 mm. The etch factor of ~2.58 and undercut range of 19-97 μm determine how much the mask must be biased to land the finished dimension on target.

Design Rule Summary
• Minimum hole diameter range: 120-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 19-97 μm
• Typical etch factor (EF): 2.58

Yield & Production Economics

This formula delivers a typical yield of 96.4% (range 95.5-96.7%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.

Typical Applications

Typical applications for SUS310S processed with FeCl₃+HCl include precision shims, encoder discs, RF/EMI shields, surgical and dental components, fuel-cell bipolar plates, and fine filter meshes. The formula's tolerance band and yield make it well suited to medium-to-high-volume precision flat parts.

More Stainless Steel Formulas

Other formulas in the same material family.

AM350 Stainless Steel FeCl₃+HCl Through etch (double-sided) SUS2205 Duplex Stainless FeCl₃+HCl Through etch (double-sided) SUS2507 Super Duplex FeCl₃+HCl Through etch (double-sided) SUS301 FeCl₃+HCl Through etch (double-sided) SUS301 FeCl₃+HCl Through etch (double-sided) SUS302 FeCl₃+HCl Through etch (double-sided)

Frequently Asked Questions

Standard pre-treatment is degrease, micro-etch to activate the surface, rinse, photoresist lamination or coating, UV exposure through the artwork, and develop. Pre-treatment quality directly drives yield for SUS310S: poor degreasing causes resist adhesion failures that show up as random pinhole defects in the etched pattern.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.

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