Nickel Superalloys FeCl₃+HCl

Chemical Etching Formula
Waspaloy with FeCl₃+HCl

The FeCl₃+HCl chemistry is a proven formula for Waspaloy. This reference sheet lists the concentration (48 °Bé), specific gravity (1.450), bath temperature (56°C), and the full range of conveyor speeds and feature tolerances that result. Use it to size your process before committing to a production trial.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
48 °Bé Concentration
1.450 Specific Gravity
56 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.1-0.3 mm Thickness Range
0.20 mm Typical Thickness
0.12-0.65 m/min Conveyor Speed Range
0.21 m/min Typical Speed
120-360 μm Min Hole Ø Range
100-300 μm Min Line Width Range
21-62 μm Undercut Range
2.40 Etch Factor (EF)
94.9% Typical Yield (94.6-95.2%)

Why FeCl₃+HCl for Waspaloy?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like Waspaloy. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on Waspaloy is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Hold the bath at 56°C with concentration 48 °Bé (specific gravity 1.450). Across the 0.1-0.3 mm thickness range, conveyor speed runs from 0.12-0.65 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.21 m/min for 0.20 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 120-360 μm and the minimum line width ranges 100-300 μm across the 0.1-0.3 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 21-62 μm, and the etch factor is about 2.40. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 120-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 21-62 μm
• Typical etch factor (EF): 2.40

Yield & Production Economics

This formula delivers a typical yield of 94.9% (range 94.6-95.2%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.

Typical Applications

Typical applications for Waspaloy processed with FeCl₃+HCl include turbine-engine seals, high-temperature gaskets, and aerospace fluidic plates. The formula's tolerance band and yield make it well suited to medium-to-high-volume precision flat parts.

More Nickel Superalloys Formulas

Other formulas in the same material family.

Frequently Asked Questions

Typical mass-production yield is 94.9%, within an observed range of 94.6-95.2%. The leading yield-loss modes are photoresist pinhole defects and rinse contamination, so the fastest route to a higher number is tighter incoming-sheet and coating control rather than changes to the etch bath.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.