Chemical Etching Formula
H80 brass
with FeCl₃
Formula Summary
The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.
Why FeCl₃ for H80 brass?
Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like H80 brass. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on H80 brass is anisotropic etching with predictable undercut and an easily regenerated spent bath.
Process Window & Bath Control
Bath control for H80 brass in FeCl₃: temperature 43°C, concentration 36 °Bé, specific gravity 1.340. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-3.11 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.
Design Rules & Tolerances
Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-600 μm and the minimum line width ranges 100-500 μm across the 0.05-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 9-88 μm, and the etch factor is about 2.83. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.
• Minimum hole diameter range: 60-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 9-88 μm
• Typical etch factor (EF): 2.83
Yield & Production Economics
Typical mass-production yield for H80 brass in the FeCl₃ system is 97.8%, within an observed range of 97-98.1%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.
Typical Applications
Typical applications for H80 brass processed with FeCl₃ include lead frames, busbars, flexible heater elements, RF gaskets, and precision electrical contacts. The formula's tolerance band and yield make it well suited to medium-to-high-volume precision flat parts.
Process Equipment & Material Reference
Production of H80 brass parts using the FeCl₃ formula described above runs on a knife-mold etching machine configured for through etch (double-sided). The bath chemistry, conveyor speed, and rinse cascade detailed on this page reflect the operating profile we use on a live spray-etching line for this alloy.
Related to this formula, the Brass chemical etching guide page documents the full process envelope for the same alloy family, including pre-treatment chemistry and post-etch inspection criteria.
Production Use Cases for This Formula
Typical end-uses for H80 brass run on this formula include stainless steel shower-head filter mesh, soy-milk-maker filtration mesh, and cold-press juicer filtration mesh. The 43°C bath and 0.05-0.5 mm supported thickness range cover most of the production work in these segments without re-tuning chemistry.
Adjacent applications usually transfer onto this same formula with no chemistry change, sometimes only a conveyor speed tweak. Drop a drawing and a target volume and we will return a process card built off the parameters on this page.
More Copper & Brass Formulas
Other formulas in the same material family.
Frequently Asked Questions
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- ASTM B912: Standard Specification for Passivation of Stainless Steels
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
Need a Quote for This Process?
WET Etched runs production wet chemical etching lines using the FeCl₃ chemistry. Send us your part drawing and quantity for a full process quote.
