Precision Alloys FeCl₃+HCl

Chemical Etching Formula
Ni50 Alloy with FeCl₃+HCl

Working with Ni50 Alloy on a chemical etch line begins with the right formula. The FeCl₃+HCl system documented below produces through etch (double-sided) across 0.05-0.2 mm sheet, with a minimum hole-diameter range of 60-240 μm and a minimum line-width range of 100-200 μm. The numbers scale with thickness — thinner stock yields finer features.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
44 °Bé Concentration
1.410 Specific Gravity
50 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.2 mm Thickness Range
0.10 mm Typical Thickness
0.34-2.72 m/min Conveyor Speed Range
0.96 m/min Typical Speed
60-240 μm Min Hole Ø Range
100-200 μm Min Line Width Range
9-36 μm Undercut Range
2.75 Etch Factor (EF)
96.7% Typical Yield (96.4-96.8%)

Why FeCl₃+HCl for Ni50 Alloy?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like Ni50 Alloy. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on Ni50 Alloy is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

The process window for this FeCl₃+HCl formula centres on 50°C and 44 °Bé. Conveyor speed spans 0.34-2.72 m/min over the 0.05-0.2 mm thickness band; the typical operating point is 0.96 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-240 μm and the minimum line width ranges 100-200 μm across the 0.05-0.2 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 9-36 μm, and the etch factor is about 2.75. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 60-240 μm
• Minimum line width range: 100-200 μm
• Single-side undercut range: 9-36 μm
• Typical etch factor (EF): 2.75

Yield & Production Economics

Expect a yield in the 96.4-96.8% range for Ni50 Alloy with FeCl₃+HCl, with 96.7% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Typical applications for Ni50 Alloy processed with FeCl₃+HCl include hermetic sealing rings, lead frames matched to glass/ceramic, and magnetic shielding. The formula's tolerance band and yield make it well suited to medium-to-high-volume precision flat parts.

More Precision Alloys Formulas

Other formulas in the same material family.

Frequently Asked Questions

Run the bath at 50°C. Holding much above 55°C can degrade photoresist adhesion and erode feature edges; running below 45°C slows the etch and forces a conveyor-speed reduction. Production lines hold 50°C within ±1.5°C using redundant PID control.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.