Chemical Etching Formula
Al3003
with FeCl₃+HCl
Formula Summary
The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.
Why FeCl₃+HCl for Al3003?
On Al3003, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every Al3003 etch line runs a variant of this formula.
Process Window & Bath Control
Bath control for Al3003 in FeCl₃+HCl: temperature 40°C, concentration 32 °Bé, specific gravity 1.270. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-2.9 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.
Design Rules & Tolerances
Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-600 μm and the minimum line width ranges 100-500 μm across the 0.05-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 10-97 μm, and the etch factor is about 2.58. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.
• Minimum hole diameter range: 60-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 10-97 μm
• Typical etch factor (EF): 2.58
Yield & Production Economics
This formula delivers a typical yield of 97.5% (range 96.8-97.9%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.
Typical Applications
Parts produced with the FeCl₃+HCl formula on Al3003 are common in lightweight RF shields, heat-spreader masks, nameplates, decorative trim, and lightweight structural lattices. The burr-free, stress-free nature of chemical etching makes it the preferred process wherever flatness and edge quality matter more than raw throughput.
More Aluminum Alloys Formulas
Other formulas in the same material family.
Frequently Asked Questions
Need a Quote for This Process?
WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.
