Aluminum Alloys FeCl₃+HCl

Chemical Etching Formula
Al1100 with FeCl₃+HCl

The FeCl₃+HCl chemistry is a proven formula for Al1100. This reference sheet lists the concentration (30 °Bé), specific gravity (1.250), bath temperature (38°C), and the full range of conveyor speeds and feature tolerances that result. Use it to size your process before committing to a production trial.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
30 °Bé Concentration
1.250 Specific Gravity
38 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.01-0.5 mm Thickness Range
0.08 mm Typical Thickness
0.12-21.41 m/min Conveyor Speed Range
1.50 m/min Typical Speed
15-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
2-95 μm Undercut Range
2.62 Etch Factor (EF)
97.8% Typical Yield (96.8-98.5%)

Why FeCl₃+HCl for Al1100?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like Al1100. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on Al1100 is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

The process window for this FeCl₃+HCl formula centres on 38°C and 30 °Bé. Conveyor speed spans 0.12-21.41 m/min over the 0.01-0.5 mm thickness band; the typical operating point is 1.50 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 15-600 μm and the minimum line width ranges 100-500 μm across the 0.01-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 2-95 μm, and the etch factor is about 2.62. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 15-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 2-95 μm
• Typical etch factor (EF): 2.62

Yield & Production Economics

Expect a yield in the 96.8-98.5% range for Al1100 with FeCl₃+HCl, with 97.8% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Al1100 etched with this recipe typically ends up in lightweight RF shields, heat-spreader masks, nameplates, decorative trim, and lightweight structural lattices. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Aluminum Alloys Formulas

Other formulas in the same material family.

Al1060 FeCl₃+HCl Through etch (double-sided) Al1060 FeCl₃+HCl Through etch (double-sided) Al2014 FeCl₃+HCl Through etch (double-sided) Al2017 FeCl₃+HCl Through etch (double-sided) Al2024 FeCl₃+HCl Through etch (double-sided) Al3003 FeCl₃+HCl Through etch (double-sided)

Frequently Asked Questions

Standard pre-treatment is degrease, micro-etch to activate the surface, rinse, photoresist lamination or coating, UV exposure through the artwork, and develop. Pre-treatment quality directly drives yield for Al1100: poor degreasing causes resist adhesion failures that show up as random pinhole defects in the etched pattern.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.

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