Chemical Etching Formula
Al5052
with FeCl₃+HCl
Formula Summary
The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.
Why FeCl₃+HCl for Al5052?
On Al5052, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every Al5052 etch line runs a variant of this formula.
Process Window & Bath Control
Hold the bath at 40°C with concentration 32 °Bé (specific gravity 1.270). Across the 0.01-0.5 mm thickness range, conveyor speed runs from 0.12-74.85 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 1.88 m/min for 0.07 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.
Design Rules & Tolerances
Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 8-600 μm and the minimum line width ranges 100-500 μm across the 0.01-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 1-98 μm, and the etch factor is about 2.55. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.
• Minimum hole diameter range: 8-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 1-98 μm
• Typical etch factor (EF): 2.55
Yield & Production Economics
Typical mass-production yield for Al5052 in the FeCl₃+HCl system is 97.8%, within an observed range of 96.8-98.1%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.
Typical Applications
Al5052 etched with this recipe typically ends up in lightweight RF shields, heat-spreader masks, nameplates, decorative trim, and lightweight structural lattices. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.
More Aluminum Alloys Formulas
Other formulas in the same material family.
Frequently Asked Questions
Need a Quote for This Process?
WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.