Aluminum Alloys FeCl₃+HCl

Chemical Etching Formula
Al5182 with FeCl₃+HCl

This page documents the reference wet chemical etching formula for Al5182 using the FeCl₃+HCl system. The recipe below covers a sheet-thickness range of 0.1-0.5 mm and is configured for through etch (double-sided). Every value is drawn from operational process records rather than theoretical calculation, and is provided as a starting point for your own process development.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
32 °Bé Concentration
1.270 Specific Gravity
40 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.1-0.5 mm Thickness Range
0.25 mm Typical Thickness
0.12-1.08 m/min Conveyor Speed Range
0.32 m/min Typical Speed
120-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
20-99 μm Undercut Range
2.53 Etch Factor (EF)
97.2% Typical Yield (96.5-97.5%)

Why FeCl₃+HCl for Al5182?

On Al5182, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every Al5182 etch line runs a variant of this formula.

Process Window & Bath Control

Hold the bath at 40°C with concentration 32 °Bé (specific gravity 1.270). Across the 0.1-0.5 mm thickness range, conveyor speed runs from 0.12-1.08 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.32 m/min for 0.25 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 120-600 μm, line width 100-500 μm, single-side undercut 20-99 μm — all as a function of thickness across 0.1-0.5 mm. The higher the etch factor (this formula holds about 2.53), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Design Rule Summary
• Minimum hole diameter range: 120-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 20-99 μm
• Typical etch factor (EF): 2.53

Yield & Production Economics

This formula delivers a typical yield of 97.2% (range 96.5-97.5%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.

Typical Applications

Al5182 etched with this recipe typically ends up in lightweight RF shields, heat-spreader masks, nameplates, decorative trim, and lightweight structural lattices. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Aluminum Alloys Formulas

Other formulas in the same material family.

Frequently Asked Questions

This recipe is configured for through etch (double-sided). The 40°C bath, 32 °Bé concentration, and 0.12-1.08 m/min conveyor-speed range are tuned for that depth type. Switching between through-etch and half-etch, or single- versus double-sided, requires re-tuning conveyor speed and may change the mask design.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.