Aluminum Alloys FeCl₃+HCl

Chemical Etching Formula
Al6063 with FeCl₃+HCl

This reference describes how Al6063 responds to the FeCl₃+HCl etching formula. At a bath temperature of 42°C and concentration of 34 °Bé, the recipe holds an etch factor of about 2.53 and a typical production yield of 97.5%. It is intended as engineering reference data for design, sourcing, and process planning.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
34 °Bé Concentration
1.290 Specific Gravity
42 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.5 mm Thickness Range
0.20 mm Typical Thickness
0.12-2.9 m/min Conveyor Speed Range
0.42 m/min Typical Speed
60-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
10-99 μm Undercut Range
2.53 Etch Factor (EF)
97.5% Typical Yield (96.8-97.9%)

Why FeCl₃+HCl for Al6063?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like Al6063. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on Al6063 is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

The process window for this FeCl₃+HCl formula centres on 42°C and 34 °Bé. Conveyor speed spans 0.12-2.9 m/min over the 0.05-0.5 mm thickness band; the typical operating point is 0.42 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

When laying out artwork for Al6063 at through etch (double-sided), plan for a minimum hole diameter in the 60-600 μm range and a minimum line width in the 100-500 μm range, depending on the chosen sheet thickness within 0.05-0.5 mm. The etch factor of ~2.53 and undercut range of 10-99 μm determine how much the mask must be biased to land the finished dimension on target.

Design Rule Summary
• Minimum hole diameter range: 60-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 10-99 μm
• Typical etch factor (EF): 2.53

Yield & Production Economics

Typical mass-production yield for Al6063 in the FeCl₃+HCl system is 97.5%, within an observed range of 96.8-97.9%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.

Typical Applications

Al6063 etched with this recipe typically ends up in lightweight RF shields, heat-spreader masks, nameplates, decorative trim, and lightweight structural lattices. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

Process Equipment & Material Reference

Process equipment for the Al6063 / FeCl₃+HCl combination is built around our knife-mold etching machine platform — closed-loop temperature control, redundant pump headers, and metering for bath replenishment all directly affect the etch factor and yield numbers cited on this page.

If you need a wider view of aluminum beyond this single recipe, our Aluminum chemical etching guide covers grade selection, photoresist compatibility, and typical industries that consume this metal in etched form.

Production Use Cases for This Formula

Across the markets we serve, the FeCl₃+HCl formula on this page is most often deployed for juicer filtration mesh etching, tea-infuser custom filter etching, and soy-milk-maker filtration mesh. These applications share thin-feature geometries that benefit from the predictable etch factor near 2.53 and the low single-side undercut documented above.

If your part falls into one of these classes — or a closely adjacent one — this formula is usually the right starting point. We confirm fit with a short sample run on the actual sheet stock before locking in mask artwork.

More Aluminum Alloys Formulas

Other formulas in the same material family.

Frequently Asked Questions

Run the bath at 42°C. Holding much above 47°C can degrade photoresist adhesion and erode feature edges; running below 37°C slows the etch and forces a conveyor-speed reduction. Production lines hold 42°C within ±1.5°C using redundant PID control.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.