Chemical Etching Formula
Al7050
with FeCl₃+HCl
Formula Summary
The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.
Why FeCl₃+HCl for Al7050?
On Al7050, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every Al7050 etch line runs a variant of this formula.
Process Window & Bath Control
The process window for this FeCl₃+HCl formula centres on 44°C and 36 °Bé. Conveyor speed spans 0.12-2.9 m/min over the 0.05-0.5 mm thickness band; the typical operating point is 0.42 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.
Design Rules & Tolerances
Design rules for this recipe: hole diameter 60-600 μm, line width 100-500 μm, single-side undercut 10-101 μm — all as a function of thickness across 0.05-0.5 mm. The higher the etch factor (this formula holds about 2.47), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.
• Minimum hole diameter range: 60-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 10-101 μm
• Typical etch factor (EF): 2.47
Yield & Production Economics
Typical mass-production yield for Al7050 in the FeCl₃+HCl system is 97.5%, within an observed range of 96.8-97.9%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.
Typical Applications
Al7050 etched with this recipe typically ends up in lightweight RF shields, heat-spreader masks, nameplates, decorative trim, and lightweight structural lattices. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.
Process Equipment & Material Reference
Production of Al7050 parts using the FeCl₃+HCl formula described above runs on a biomedical blade etching machine configured for through etch (double-sided). The bath chemistry, conveyor speed, and rinse cascade detailed on this page reflect the operating profile we use on a live spray-etching line for this alloy.
Related to this formula, the Aluminum chemical etching guide page documents the full process envelope for the same alloy family, including pre-treatment chemistry and post-etch inspection criteria.
Production Use Cases for This Formula
Typical end-uses for Al7050 run on this formula include stainless filtration mesh for vacuum cleaners, stainless steel mesh for aroma diffusers, and stainless steel metal filter mesh. The 44°C bath and 0.05-0.5 mm supported thickness range cover most of the production work in these segments without re-tuning chemistry.
Designs that sit slightly outside this thickness or feature-size envelope are usually addressable by a sister formula in the same etchant family. The bath chemistry stays the same; the tuning shifts to conveyor speed and resist choice.
More Aluminum Alloys Formulas
Other formulas in the same material family.
Frequently Asked Questions
Sources & References
- ASTM E407: Standard Practice for Microetching Metals and Alloys
- ASTM B912: Standard Specification for Passivation of Stainless Steels
- Photo Chemical Machining Institute — process capability guidelines
- NIST Engineering Statistics Handbook — process tolerance and capability
Standards are referenced for context. Always confirm parameters against the current published edition and your own process validation.
Need a Quote for This Process?
WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.
