Nickel Superalloys FeCl₃+HCl

Chemical Etching Formula
Inconel X-750 with FeCl₃+HCl

Working with Inconel X-750 on a chemical etch line begins with the right formula. The FeCl₃+HCl system documented below produces through etch (double-sided) across 0.1-0.3 mm sheet, with a minimum hole-diameter range of 120-360 μm and a minimum line-width range of 100-300 μm. The numbers scale with thickness — thinner stock yields finer features.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
48 °Bé Concentration
1.450 Specific Gravity
58 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.1-0.3 mm Thickness Range
0.20 mm Typical Thickness
0.12-0.62 m/min Conveyor Speed Range
0.20 m/min Typical Speed
120-360 μm Min Hole Ø Range
100-300 μm Min Line Width Range
21-62 μm Undercut Range
2.42 Etch Factor (EF)
94.6% Typical Yield (94.3-94.9%)

Why FeCl₃+HCl for Inconel X-750?

Ferric-chloride-based formulas are the industrial workhorse for ferrous, nickel, and copper-bearing alloys like Inconel X-750. The Fe³⁺ ion oxidizes the metal surface; where HCl is present it regenerates dissolved species and stabilizes chloride concentration. The result on Inconel X-750 is anisotropic etching with predictable undercut and an easily regenerated spent bath.

Process Window & Bath Control

Hold the bath at 58°C with concentration 48 °Bé (specific gravity 1.450). Across the 0.1-0.3 mm thickness range, conveyor speed runs from 0.12-0.62 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.20 m/min for 0.20 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 120-360 μm and the minimum line width ranges 100-300 μm across the 0.1-0.3 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 21-62 μm, and the etch factor is about 2.42. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 120-360 μm
• Minimum line width range: 100-300 μm
• Single-side undercut range: 21-62 μm
• Typical etch factor (EF): 2.42

Yield & Production Economics

Expect a yield in the 94.3-94.9% range for Inconel X-750 with FeCl₃+HCl, with 94.6% typical on a well-controlled line. Most rejects trace back to upstream coating and exposure rather than to the etch bath itself, so tightening photolithography control is usually the fastest path to a higher number.

Typical Applications

Inconel X-750 etched with this recipe typically ends up in turbine-engine seals, high-temperature gaskets, and aerospace fluidic plates. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Nickel Superalloys Formulas

Other formulas in the same material family.

Hastelloy C-22 FeCl₃+HCl Through etch (double-sided) Hastelloy C-276 FeCl₃+HCl Through etch (double-sided) Hastelloy X FeCl₃+HCl Through etch (double-sided) Inconel 600 FeCl₃+HCl Through etch (double-sided) Inconel 601 FeCl₃+HCl Through etch (double-sided) Inconel 625 FeCl₃+HCl Through etch (double-sided)

Frequently Asked Questions

Yes. The FeCl₃+HCl chemistry and 58°C bath are identical from a single prototype part up to full production — the chemistry does not depend on quantity. Conveyor speed stays in the 0.12-0.62 m/min range. Only the per-part economics shift, since fixed photomask and setup costs dominate at low volumes.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.

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