Aluminum Alloys FeCl₃+HCl

Chemical Etching Formula
Al5754 with FeCl₃+HCl

For engineers selecting an etching chemistry for Al5754, the FeCl₃+HCl formula shown here defines the bath composition, temperature window, and achievable feature sizes across a 0.05-0.5 mm thickness band. Typical mass-production yield for this recipe is 97.5%, with a typical conveyor speed of 0.42 m/min at 40°C.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃+HCl Etchant System
32 °Bé Concentration
1.270 Specific Gravity
40 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.5 mm Thickness Range
0.20 mm Typical Thickness
0.12-2.9 m/min Conveyor Speed Range
0.42 m/min Typical Speed
60-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
10-99 μm Undercut Range
2.53 Etch Factor (EF)
97.5% Typical Yield (96.8-97.9%)

Why FeCl₃+HCl for Al5754?

On Al5754, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every Al5754 etch line runs a variant of this formula.

Process Window & Bath Control

Bath control for Al5754 in FeCl₃+HCl: temperature 40°C, concentration 32 °Bé, specific gravity 1.270. The recipe is tuned for through etch (double-sided). Conveyor speed is the primary throughput control, ranging 0.12-2.9 m/min across the supported thickness range. Check specific gravity each shift with a calibrated hydrometer and correct with fresh make-up or water as needed.

Design Rules & Tolerances

Design rules for this recipe: hole diameter 60-600 μm, line width 100-500 μm, single-side undercut 10-99 μm — all as a function of thickness across 0.05-0.5 mm. The higher the etch factor (this formula holds about 2.53), the tighter the achievable tolerance. Below the minimum feature sizes, yield falls off steeply, so treat those numbers as hard floors rather than targets.

Design Rule Summary
• Minimum hole diameter range: 60-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 10-99 μm
• Typical etch factor (EF): 2.53

Yield & Production Economics

Typical mass-production yield for Al5754 in the FeCl₃+HCl system is 97.5%, within an observed range of 96.8-97.9%. The dominant yield-loss modes are photoresist pinhole defects and rinse-water contamination. Improving incoming sheet quality and photoresist coating consistency gives the highest yield-improvement leverage for this formula.

Typical Applications

Al5754 etched with this recipe typically ends up in lightweight RF shields, heat-spreader masks, nameplates, decorative trim, and lightweight structural lattices. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Aluminum Alloys Formulas

Other formulas in the same material family.

Al1060 FeCl₃+HCl Through etch (double-sided) Al1060 FeCl₃+HCl Through etch (double-sided) Al1100 FeCl₃+HCl Through etch (double-sided) Al2014 FeCl₃+HCl Through etch (double-sided) Al2017 FeCl₃+HCl Through etch (double-sided) Al2024 FeCl₃+HCl Through etch (double-sided)

Frequently Asked Questions

Both standard dry-film photoresists (typically 1.5–2.0 mil) and aqueous-developable liquid resists are compatible with FeCl₃+HCl at 40°C. Resist choice is driven by resolution: features near the fine end of the 100-500 μm line-width range usually call for liquid resist, while larger features can use lower-cost dry film.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃+HCl chemistry. Send us your part drawing and quantity for a full process quote.

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