Chemical Etching Formula
SUS430 with FeCl₃

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

Why FeCl₃ for SUS430?

On SUS430, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every SUS430 etch line runs a variant of this formula.

Process Window & Bath Control

The process window for this FeCl₃ formula centres on 48°C and 40 °Bé. Conveyor speed spans 36.37 m/min over the 0.01 mm thickness band; the typical operating point is 36.37 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

When laying out artwork for SUS430 at half etch (single-sided), plan for a minimum hole diameter in the 12 μm range and a minimum line width in the 100 μm range, depending on the chosen sheet thickness within 0.01 mm. The etch factor of ~2.85 and undercut range of 2 μm determine how much the mask must be biased to land the finished dimension on target.

Yield & Production Economics

This formula delivers a typical yield of 97.8% (range 97.8%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.

Typical Applications

SUS430 etched with this recipe typically ends up in precision shims, encoder discs, RF/EMI shields, surgical and dental components, fuel-cell bipolar plates, and fine filter meshes. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

Process Equipment & Material Reference

On the shop floor, this SUS430 + FeCl₃ recipe is implemented on a wet chemical etching machine. The 48°C bath setpoint and 36.37 m/min conveyor range correspond to verified production envelopes on that equipment for half etch (single-sided).

If you need a wider view of stainless beyond this single recipe, our Stainless Steel chemical etching guide covers grade selection, photoresist compatibility, and typical industries that consume this metal in etched form.

Production Use Cases for This Formula

Typical end-uses for SUS430 run on this formula include cold-press juicer filtration mesh, heat-dissipation vent etching for VC cooling, and high-precision etched lead frames. The 48°C bath and 0.01 mm supported thickness range cover most of the production work in these segments without re-tuning chemistry.

Designs that sit slightly outside this thickness or feature-size envelope are usually addressable by a sister formula in the same etchant family. The bath chemistry stays the same; the tuning shifts to conveyor speed and resist choice.

Other Metals Etched with FeCl₃

The FeCl₃ chemistry is also documented for these alloys.

More Stainless Steel Formulas

Other formulas in the same material family.

Frequently Asked Questions