Stainless Steel FeCl₃

Chemical Etching Formula
SUS430 with FeCl₃

For engineers selecting an etching chemistry for SUS430, the FeCl₃ formula shown here defines the bath composition, temperature window, and achievable feature sizes across a 0.01 mm thickness band. Typical mass-production yield for this recipe is 97.8%, with a typical conveyor speed of 36.37 m/min at 48°C.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

FeCl₃ Etchant System
40 °Bé Concentration
1.380 Specific Gravity
48 °C Bath Temperature
Half etch (single-sided) Etch Depth Type
0.01 mm Thickness Range
0.01 mm Typical Thickness
36.37 m/min Conveyor Speed Range
36.37 m/min Typical Speed
12 μm Min Hole Ø Range
100 μm Min Line Width Range
2 μm Undercut Range
2.85 Etch Factor (EF)
97.8% Typical Yield (97.8%)

Why FeCl₃ for SUS430?

On SUS430, the ferric chloride system attacks the alloy's oxide layer continuously while ferric ions drive dissolution. It is regenerable, compatible with standard photolithography, and produces clean burr-free edges — which is why nearly every SUS430 etch line runs a variant of this formula.

Process Window & Bath Control

The process window for this FeCl₃ formula centres on 48°C and 40 °Bé. Conveyor speed spans 36.37 m/min over the 0.01 mm thickness band; the typical operating point is 36.37 m/min. Every 5°C drop in bath temperature requires roughly a 30% reduction in conveyor speed to hold the same etch depth, so temperature stability is the single biggest lever on consistency.

Design Rules & Tolerances

When laying out artwork for SUS430 at half etch (single-sided), plan for a minimum hole diameter in the 12 μm range and a minimum line width in the 100 μm range, depending on the chosen sheet thickness within 0.01 mm. The etch factor of ~2.85 and undercut range of 2 μm determine how much the mask must be biased to land the finished dimension on target.

Design Rule Summary
• Minimum hole diameter range: 12 μm
• Minimum line width range: 100 μm
• Single-side undercut range: 2 μm
• Typical etch factor (EF): 2.85

Yield & Production Economics

This formula delivers a typical yield of 97.8% (range 97.8%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.

Typical Applications

SUS430 etched with this recipe typically ends up in precision shims, encoder discs, RF/EMI shields, surgical and dental components, fuel-cell bipolar plates, and fine filter meshes. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Stainless Steel Formulas

Other formulas in the same material family.

AM350 Stainless Steel FeCl₃+HCl Through etch (double-sided) SUS2205 Duplex Stainless FeCl₃+HCl Through etch (double-sided) SUS2507 Super Duplex FeCl₃+HCl Through etch (double-sided) SUS301 FeCl₃+HCl Through etch (double-sided) SUS301 FeCl₃+HCl Through etch (double-sided) SUS302 FeCl₃+HCl Through etch (double-sided)

Frequently Asked Questions

This recipe is configured for half etch (single-sided). The 48°C bath, 40 °Bé concentration, and 36.37 m/min conveyor-speed range are tuned for that depth type. Switching between through-etch and half-etch, or single- versus double-sided, requires re-tuning conveyor speed and may change the mask design.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the FeCl₃ chemistry. Send us your part drawing and quantity for a full process quote.

Request a Quote Browse Formulas