Titanium Alloys HF(5%)+HNO₃(30%)

Chemical Etching Formula
TA3 commercially pure titanium with HF(5%)+HNO₃(30%)

The HF(5%)+HNO₃(30%) chemistry is a proven formula for TA3 commercially pure titanium. This reference sheet lists the concentration (as specified), specific gravity (1.180), bath temperature (34°C), and the full range of conveyor speeds and feature tolerances that result. Use it to size your process before committing to a production trial.

Formula Summary

The table below summarizes every parameter that defines this etching formula. Values listed as ranges scale with sheet thickness across the supported band.

HF(5%)+HNO₃(30%) Etchant System
— °Bé Concentration
1.180 Specific Gravity
34 °C Bath Temperature
Through etch (double-sided) Etch Depth Type
0.05-0.5 mm Thickness Range
0.18 mm Typical Thickness
0.12-1.36 m/min Conveyor Speed Range
0.17 m/min Typical Speed
60-600 μm Min Hole Ø Range
100-500 μm Min Line Width Range
11-108 μm Undercut Range
2.32 Etch Factor (EF)
95.1% Typical Yield (94.2-95.4%)

Why HF(5%)+HNO₃(30%) for TA3 commercially pure titanium?

Hydrofluoric/nitric formulas are used for refractory and titanium-family metals such as TA3 commercially pure titanium because the fluoride ion is one of the few species that will break down their tenacious passive oxide. The nitric component oxidizes the freshly exposed metal so the fluoride can keep working. Handling demands are high, but for TA3 commercially pure titanium there is rarely a practical alternative.

Process Window & Bath Control

Hold the bath at 34°C with concentration as specified (specific gravity 1.180). Across the 0.05-0.5 mm thickness range, conveyor speed runs from 0.12-1.36 m/min — thinner sheets move faster, thicker sheets slower, in roughly inverse proportion to thickness. A typical mid-range setpoint is 0.17 m/min for 0.18 mm stock. Use redundant PID temperature control to hold the bath within ±1.5°C, and titrate at least once per shift.

Design Rules & Tolerances

Feature sizes scale with sheet thickness. For this formula the minimum hole diameter ranges 60-600 μm and the minimum line width ranges 100-500 μm across the 0.05-0.5 mm band, following the industry 1.2× (hole) and 1.0× (line) thickness rules. Single-side undercut ranges 11-108 μm, and the etch factor is about 2.32. Size your photomask by subtracting twice the expected undercut from each finished feature dimension.

Design Rule Summary
• Minimum hole diameter range: 60-600 μm
• Minimum line width range: 100-500 μm
• Single-side undercut range: 11-108 μm
• Typical etch factor (EF): 2.32

Yield & Production Economics

This formula delivers a typical yield of 95.1% (range 94.2-95.4%). At that rate, per-part economics are driven mostly by fixed photomask and setup cost for small batches and by sheet utilisation for large runs. The chemistry itself does not change with quantity, so the same recipe serves prototype and production volumes.

Typical Applications

TA3 commercially pure titanium etched with this recipe typically ends up in medical implants, surgical instruments, aerospace brackets, and corrosion-resistant filters. Because chemical etching applies no mechanical or thermal load, the finished features are free of work-hardening and heat-affected zones — a decisive advantage over stamping or laser cutting for these uses.

More Titanium Alloys Formulas

Other formulas in the same material family.

TA1 commercially pure titanium HF(5%)+HNO₃(30%) Through etch (double-sided) TA1 commercially pure titanium HF(5%)+HNO₃(30%) Through etch (double-sided) TA1 commercially pure titanium HF(5%)+HNO₃(30%) Half etch (single-sided) Ta1 Pure Tantalum HF(8%)+HNO₃(30%) Through etch (double-sided) TA2 commercially pure titanium HF(5%)+HNO₃(30%) Through etch (double-sided) TC1 Titanium Alloy HF(5%)+HNO₃(30%) Through etch (double-sided)

Frequently Asked Questions

The typical etch factor for this recipe is 2.32 — vertical etch depth is about 2.32× the single-side undercut. Higher EF means tighter feature tolerance; values near or above 3.0 are close to best-in-class for wet etching, and TA3 commercially pure titanium in HF(5%)+HNO₃(30%) sits in the typical production range.

Need a Quote for This Process?

WET Etched runs production wet chemical etching lines using the HF(5%)+HNO₃(30%) chemistry. Send us your part drawing and quantity for a full process quote.

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